X-On Electronics has gained recognition as a prominent supplier of ETRX357-SFT-026-00-2.0.16 Zigbee Modules - 802.15.4 across the USA, India, Europe, Australia, and various other global locations. ETRX357-SFT-026-00-2.0.16 Zigbee Modules - 802.15.4 are a product manufactured by Silicon Labs. We provide cost-effective solutions for Zigbee Modules - 802.15.4, ensuring timely deliveries around the world.

ETRX357-SFT-026-00-2.0.16 Silicon Labs

ETRX357-SFT-026-00-2.0.16 electronic component of Silicon Labs
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Part No.ETRX357-SFT-026-00-2.0.16
Manufacturer: Silicon Labs
Category: Zigbee Modules - 802.15.4
Description: Zigbee / 802.15.4 Modules Telegesis ETRX357 Module Chip Ant R309
Datasheet: ETRX357-SFT-026-00-2.0.16 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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We are delighted to provide the ETRX357-SFT-026-00-2.0.16 from our Zigbee Modules - 802.15.4 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ETRX357-SFT-026-00-2.0.16 and other electronic components in the Zigbee Modules - 802.15.4 category and beyond.

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Telegesis TG-ETRX35X-PM-010-110 ETRX351 and ETRX357 Product Manual 1.20 ETRX35x ZIGBEE MODULES PRODUCT MANUAL 2015 Silicon Labs ETRX35x Product Manual ETRX351 and ETRX357 Table of Contents 1 INTRODUCTION ................................................................................................................. 5 1.1 Hardware Description ....................................................................................................... 5 2 PRODUCT APPROVALS ................................................................................................... 6 2.1 FCC Approvals ................................................................................................................. 6 FCC Labelling Requirements ........................................................................................... 7 2.2 IC (Industry Canada) Approvals ....................................................................................... 7 2.3 European Certification (ETSI)........................................................................................... 8 2.4 ICASA Approvals ............................................................................................................. 8 2.5 Australia and New Zealand (C-Tick) ................................................................................. 8 2.6 Brazil ................................................................................................................................ 9 2.7 Declarations of Conformity ............................................................................................... 9 2.8 IEEE 802.15.4 .................................................................................................................. 9 2.9 The ZigBee Protocol ...................................................................................................... 10 3 MODULE PINOUT ............................................................................................................ 11 4 HARDWARE DESCRIPTION ............................................................................................ 13 4.1 Hardware Interface ......................................................................................................... 13 5 FIRMWARE DESCRIPTION ............................................................................................. 14 5.1 Token Settings ............................................................................................................... 15 5.2 Custom Firmware ........................................................................................................... 15 5.3 Software Interface .......................................................................................................... 16 6 ABSOLUTE MAXIMUM RATINGS ................................................................................... 17 6.1 Environmental Characteristics ........................................................................................ 17 6.2 Recommended Operating Conditions............................................................................. 17 7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 18 8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 20 9 A/D CONVERTER CHARACTERISTICS .......................................................................... 21 10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 21 10.1 TX Power Characteristics ............................................................................................... 23 11 PHYSICAL DIMENSIONS ................................................................................................. 25 12 RECOMMENDED SOLDERING TEMPERATURE PROFILE ........................................... 27 13 PRODUCT LABEL DRAWING ......................................................................................... 28 14 RECOMMENDED FOOTPRINT ........................................................................................ 29 14.1 Pad dimensions ............................................................................................................. 29 14.2 Recommended Placement ............................................................................................. 30 14.3 Example carrier board .................................................................................................... 32 15 RELIABILITY TESTS ........................................................................................................ 33 16 APPLICATION NOTES ..................................................................................................... 33 16.1 Safety Precautions ......................................................................................................... 33 16.2 Design Engineering Notes .............................................................................................. 33 2015 Silicon Labs - 2 - ETRX35x Product Manual (Rev 1.20)

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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