SLWRB4502B Silicon Labs

Reference Manual BRD4502B (Rev. B00) The EZR32LG family of Wireless MCUs deliver a high performance, low energy wireless solution inte- grated into a small form factor package. By combining a high performance sub-GHz RF transceiver with an energy efficient 32-bit MCU, the family provides designers the ultimate in flexibility with a fam- ily of pin-compatible devices that scale from 64/128/256 kB of flash and support Silicon Labs EZRadio or EZRadioPRO transceivers. The ultra-low power operating modes and fast wake-up times of the Silicon Labs energy friendly 32-bit MCUs, combined with the low transmit and receive power con- sumption of the sub-GHz radio, result in a solution optimized for battery powered applications. To develop and/or evaluate the EZR32 Leopard Gecko the EZR32LG Radio Board can RADIO BOARD FEATURES be connected to the Wireless Starter Kit Mainboard to get access to display, buttons and additional features from Expansion Boards. Wireless MCU: EZR32LG330F256R55G CPU core: ARM Cortex-M3 Flash memory: 256 kB RAM: 32 kB Sub-GHz transceiver integrated in the Wireless MCU: EZRadioPRO Operation frequency: 434 MHz Transmit power: 10 dBm Single antenna connector both for transmit and receive Crystals for LFXO and HFXO: 32.768kHz and 48 MHz. Crystal for RF: 30 MHz Backup Power Domain Capacitor Full speed USB 2.0 (12 Mbps) silabs.com Smart. Connected. Energy-friendly. Rev. 1.10 BRD4502B (Rev. B00) Table of Contents 1. Radio Board Connector Pin Associations.....................1 2. EZR32LG330 System-on-Chip Summary.....................2 2.1 EZR32 Wireless MCU ...........................2 2.2 EZRadio RF Transceiver ..........................2 2.3 Communcation Between the MCU and the Radio..................2 3. EZR32LG Radio Board block description.....................4 3.1 USB.................................4 3.2 RF Crystal Oscillator ...........................4 3.3 LF Crystal Oscillator (LFXO).........................4 3.4 HF Crystal Oscillator (HFXO).........................4 3.5 Backup Power Domain Capacitor .......................4 3.6 RF Matching Network ...........................5 3.7 SMA connector .............................5 3.8 Radio Board Connectors ..........................5 4. RF section ................................6 4.1 Matching network.............................6 5. Mechanical details .............................8 6. RF performance ..............................9 6.1 Measurement setup............................9 6.2 Conducted Power Measurements .......................9 6.3 Radiated Power Measurements........................10 7. Document Revision History ......................... 12 8. Errata ................................. 13 Table of Contents ii