WFM200SS22XNA3R Silicon Labs

or WFM200S Data Sheet The Silicon Labs WFM200S is an Ultra Low Power Wi-Fi transceiver or network co-pro- KEY POINTS cessor (NCP) SiP module targeted for applications where optimal RF performance, low- power consumption, and secure end-to-end solution, together with fast time to market, IEEE 802.11 b/g/n compliant are key requirements. Embedded high efficiency antenna The very compact 6.5mm x 6.5mm WFM200S SiP module contains an embedded an- Integrated crystal and shield tenna, high frequency crystal, and shield. This all-inclusive module offer the fastest time 105C ambient temp support to market. TX power: up to +15.1 dBm The WFM200S integrates a balun, T/R switch, LNA and PA for the best possible RF per- RX sensitivity: -96.3 dBm formance. Co-existence with external 2.4GHz transceivers is supported via a PTA inter- Integrated switched antenna diversity face. support Ultra low power consumption WFM200S has been optimized for resource and power constrained devices at the RF, protocol and firmware levels. Power conscious devices can take advantage of these fea- Secure and signed software tures in both active and idle/sleep modes. Encrypted host interface communication Linux and RTOS host support For security sensitive applications, the WFM200S provides secure boot and a secure, Certifications encrypted host interface. Robust security is made possible with the native integrated CE, FCC, ISED, Japan, South Korea True Random Number Generator and OTP memory for confidential encryption key stor- 6.5 x 6.5 mm SiP Module age. The WFM200S fits well witl Linux-based and RTOS-based host processors. WFM200S supports both the 802.11 split MAC architecture and the 802.11 full MAC software archi- tecture. WFM200S communicates with the external host controller over the SPI or SDIO interface. VDDPA VDDD VDDIO 3.3V 1.8-3.3V 1.8-3.3V WF200 IC SPI/SDIO Integral Antenna 802.11 b/g/n Transceiver Integrated RF, Baseband, RESETn & WUP Balun PTA/GPIO RF1 FEM/GPIO RF2 CLK 32K XTAL 38.4 MHz WIRQ silabs.com Building a more connected world. Rev. 1.1 optionalTable of Contents 1. Features List ...............................4 2. Ordering Information ............................5 3. System Overview..............................6 3.1 Introduction...............................6 3.2 Wi-Fi Supported 2.4 GHz Bandwidth and Channels .................7 4. Electrical Specifications ...........................8 4.1 Absolute Maximum Ratings..........................8 4.2 Operating Conditions............................9 4.3 Power Consumption ............................10 4.4 RF Transmitter General Characteristics .....................11 4.4.1 RF Transmitter Characteristics .......................12 4.5 RF Receiver General Characteristics ......................12 4.5.1 RF Receiver Characteristics........................13 4.6 Reference Oscillator and Low Power Clock Characteristics...............14 4.6.1 Low Power 32.768 kHz Clock Input Requirements ................14 4.7 Interface Terminal Characteristics .......................14 4.7.1 Supply Terminal Specifications.......................14 4.7.2 Digital I/O Terminal Specifications......................15 4.8 Host Interface ..............................15 4.8.1 SPI Specification............................17 4.8.2 SDIO Specification ...........................18 5. Typical Applications and Connections..................... 19 5.1 Typical Application Circuit for SDIO Host Interface..................19 5.2 Typical Application Circuit for SPI Host Interface ..................20 5.3 Power States and Low-Power Modes .....................21 5.4 RF Connections .............................21 5.4.1 RF Ports ..............................21 5.4.2 Antenna Diversity ...........................21 5.4.3 Embedded Antenna Pins.........................21 5.5 Clocks.................................21 5.5.1 High Frequency Crystal Oscillator......................21 5.5.2 LP CLK Port .............................22 5.6 Multi-Protocol Coexistence..........................22 6. Pin Descriptions ............................. 23 7. Package Outline ............................. 25 8. Land Pattern ..............................29 9. Top Marking............................... 31 silabs.com Building a more connected world. Rev. 1.1 2