Ag5810 Silvertel

V1.1 April 2020 Datasheet Ag5810 Silvertel 60W IEEE802.3bt PD Module Features IEEE802.3bt Type 4 compliant 60 Watt Output Power Very small size High efficiency DC/DC converter 12V or 24V output adjustable 1500V isolation (input to output) Input voltage range 36V to 57V Low output ripple and noise Minimal (low cost) external components required Overload, thermal and short-circuit protection Silvertel design-in assistance Description The Ag5810 is an IEEE802.3bt Type 4 Power over Ethernet module that can deliver up to 60 Watts of output power. Suitable for applications such as WiMAX access points, PTZ cameras, notebook computers, IP cameras, LED lighting, intelligent displays and thin client terminals. The Ag5810 extracts power from an IEEE802.3bt Power Sourcing Equipment (PSE) over an Ethernet cable. Conforming to the IEEE802.3bt standard for signature recognition with class programming-fixed to class 7. It has been designed to work with IEEE802.3bt PSEs and existing high power PSEs from leading manufacturers. The high efficiency DC/DC converter operates over a wide input voltage range and provides a regulated low ripple and low noise output. The DC/DC converter also has built-in overload, thermal and short-circuit output protection. Silver Telecom 2020 V1.1 April 2020 Ag5810 Datasheet 60W IEEE802.3bt PD Module Table of Contents 1 Product Overview ...................................................................................................................................... 3 1.1 Ag5810 Product Selector ................................................................................................................. 3 1.2 Pin Description ................................................................................................................................. 4 2 Functional Description .............................................................................................................................. 5 2.1 Overview........................................................................................................................................... 5 2.2 Power Supply ................................................................................................................................... 5 2.3 Input .................................................................................................................................................. 6 2.3.1 PD Signature ............................................................................................................................ 6 2.3.2 Power Classification ................................................................................................................. 6 2.3.3 PSE Type Detection ................................................................................................................. 7 2.4 Output ............................................................................................................................................... 8 2.4.1 DC/DC Converter ..................................................................................................................... 8 2.4.2 Output Configuration ................................................................................................................ 8 2.4.3 Output Adjustment ................................................................................................................... 9 2.4.4 Output Power ......................................................................................................................... 10 2.5 Typical Connections ....................................................................................................................... 11 2.6 High Power Applications ................................................................................................................ 12 2.7 Additional Output Filtering .............................................................................................................. 13 3 Operating Temperature Range ............................................................................................................... 14 3.1 PCB Thermal Layout ...................................................................................................................... 16 3.2 Heatpad Footprint ........................................................................................................................... 17 3.3 Heat Sink Assembly ....................................................................................................................... 18 4 Isolation ................................................................................................................................................... 19 5 Protection ................................................................................................................................................ 20 6 EMC ........................................................................................................................................................ 20 7 Electrical Characteristics ......................................................................................................................... 21 7.1 Absolute Maximum Ratings............................................................................................................ 21 7.2 Recommended Operating Conditions ............................................................................................ 21 7.3 DC Electrical Characteristics .......................................................................................................... 22 8 Package .................................................................................................................................................. 23 Table of Figures Figure 1: Block Diagram .................................................................................................................................... 3 Figure 2: Ag5810 Package Format .................................................................................................................... 3 Figure 3: Typical System Diagram .................................................................................................................... 5 Figure 4: Physical Layer Detect Configuration .................................................................................................. 7 Figure 5: Output Configurations ........................................................................................................................ 8 Figure 6: Output Adjustment .............................................................................................................................. 9 Figure 7: Typical Connection Diagram ............................................................................................................ 11 Figure 8: High Power configuration ................................................................................................................. 12 Figure 9: Additional Output Filtering ................................................................................................................ 13 Figure 10: Operating Temperature .................................................................................................................. 14 Figure 11: Operating Temperature (Thermally connected to PCB) ................................................................ 15 Figure 12: Suggested PCB Thermal Layout .................................................................................................... 16 Figure 13: Suggested Heatpad Footprint ........................................................................................................ 17 Figure 14: Suggested Heat Sink Assembly ..................................................................................................... 18 Figure 15: Position of the Isolation Barrier ...................................................................................................... 19 Figure 16: EMC Filtering .................................................................................................................................. 20 Silver Telecom 2020 2