Ag9912M Silvertel

V2.4 April 2020 Datasheet Ag9900 Silvertel Ultra Miniature PoE Module Features IEEE802.3af compliant 1500V isolated DC/DC Converter Ultra Low Profile Tiny SMT (14mm x 21mm X 13mm) or DIL package (14mm x 21mm X 8mm) Low cost Input voltage range 36V to 57V Minimal external components required Short-circuit protection Industrial temperature option available Over temperature protection (Industrial Temperature version- MT or LP) Adjustable Output Silvertel design-in assistance Description The Ag9900 Power-over-Ethernet (PoE) modules are the smallest POE solution in the world and designed to extract power from a conventional twisted pair Category 5 Ethernet cable, conforming to the IEEE 802.3af PoE standard. The Ag9900 signature and control circuit provides the PoE compatibility signature required by the Power Sourcing Equipment (PSE) before applying up to 15W power to the port. The Ag9900 provides a Class 0 signature. The DC/DC converter operates over a wide input voltage range and provides a regulated output. The DC/DC converter also has built-in short-circuit output protection. Silver Telecom 2020 V2.4 April 2020 Ag9900 Datasheet Ultra Miniature PoE Module Table of Contents 1 Product Overview ................................................................................................................................... 3 1.1 Ag9900 Product Selector ................................................................................................................. 3 1.2 Package Format ............................................................................................................................... 4 1.3 Pin Description ................................................................................................................................. 5 2 Functional Description ........................................................................................................................... 6 2.1 Typical Connections ......................................................................................................................... 6 2.2 Input .................................................................................................................................................. 7 2.2.1 PD Signature ............................................................................................................................ 7 2.2.2 Power Classification ................................................................................................................. 7 2.2.3 Start-up Power ......................................................................................................................... 7 2.3 Output ............................................................................................................................................... 8 2.3.1 Output Adjustment ................................................................................................................... 8 2.3.2 Additional Output Filtering ........................................................................................................ 9 3 Protection .............................................................................................................................................. 10 3.1 Input Protection .............................................................................................................................. 10 3.2 Thermal Protection ......................................................................................................................... 10 4 Operating Temperature Range ............................................................................................................ 11 4.1 Thermal Considerations ................................................................................................................. 13 5 Typical Application ............................................................................................................................... 15 6 Isolation ................................................................................................................................................. 16 6.1 Layout Consideration ..................................................................................................................... 16 7 EMC ........................................................................................................................................................ 17 8 Electrical Characteristics ..................................................................................................................... 18 1 8.1 Absolute Maximum Ratings .......................................................................................................... 18 8.2 Recommended Operating Conditions ............................................................................................ 18 8.3 DC Electrical Characteristics .......................................................................................................... 18 9 Package .................................................................................................................................................. 20 9.1 Ag9900M/MT .................................................................................................................................. 20 9.2 Ag9900LP ....................................................................................................................................... 21 Table of Figures Figure 1: Block Diagram .................................................................................................................................... 4 Figure 2: Ag9900 Package Format .................................................................................................................... 4 Figure 6: Typical Connection Diagram .............................................................................................................. 6 Figure 3: Typical System Diagram .................................................................................................................... 7 Figure 4: Output Adjustment .............................................................................................................................. 8 Figure 5: Output Filtering ................................................................................................................................... 9 Figure 7: Ag9900 Input Protection ................................................................................................................... 10 Figure 8: Ag9924M Operating Profile .............................................................................................................. 11 Figure 9: Ag9912M Operating Profile .............................................................................................................. 12 Figure 10: Ag9905M Operating Profile ............................................................................................................ 12 Figure 11: Ag9903M Operating Profile ............................................................................................................ 12 Figure 12: Ag9912LP Operating Profile ........................................................................................................... 12 Figure 13: Ag9905LP Operating Profile ........................................................................................................... 12 Figure 14: Ag9903LP Operating Profile ........................................................................................................... 12 Figure 15: Ag9900M Thermal Relief ................................................................................................................ 13 Figure 16: Thermal Gap Pad Position ............................................................................................................. 14 Figure 17: Typical Application ......................................................................................................................... 15 Figure 18: Layout Consideration ..................................................................................................................... 16 Figure 19: EMC Filtering .................................................................................................................................. 17 Silver Telecom 2020 2