X-On Electronics has gained recognition as a prominent supplier of BOB-09868 Audio IC Development Tools across the USA, India, Europe, Australia, and various other global locations. BOB-09868 Audio IC Development Tools are a product manufactured by SparkFun. We provide cost-effective solutions for Audio IC Development Tools, ensuring timely deliveries around the world.

BOB-09868 SparkFun

BOB-09868 electronic component of SparkFun
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Part No.BOB-09868
Manufacturer: SparkFun
Category: Audio IC Development Tools
Description: Audio IC Development Tools SparkFun MEMS Microphone Breakout
Datasheet: BOB-09868 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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1 : USD 11.531
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MOQ : 1
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1 : USD 15.7657
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We are delighted to provide the BOB-09868 from our Audio IC Development Tools category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BOB-09868 and other electronic components in the Audio IC Development Tools category and beyond.

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Omnidirectional Microphone with Bottom Port and Analog Output Data Sheet ADMP401 FEATURES FUNCTIONAL BLOCK DIAGRAM 4.72 mm 3.76 mm 1.0 mm surface-mount package High SNR of 62 dBA Sensitivity of 42 dBV OUTPUT OUTPUT AMPLIFIER Flat frequency response from 100 Hz to 15 kHz Low current consumption of <250 A Single-ended analog output POWER High PSR of 70 dB ADMP401 Compatible with Sn/Pb and Pb-free solder processes VDD GND RoHS/WEEE compliant Figure 1. APPLICATIONS Smartphones and feature phones Teleconferencing systems Digital video cameras Bluetooth headsets Video phones Tablets GENERAL DESCRIPTION 1 The ADMP401 is a high quality, high performance, low power, enables long battery life for portable applications. The ADMP401 analog output, bottom-ported omnidirectional MEMS complies with the TIA-920 standard, Telecommunications microphone. The ADMP401 consists of a MEMS microphone Telephone Terminal Equipment Transmission Requirements for element, an impedance converter, and an output amplifier. The Wideband Digital Wireline Telephones. ADMP401 sensitivity specification makes it an excellent choice The ADMP401 is available in a thin, 4.72 mm 3.76 mm for both near field and far field applications. The ADMP401 has 1.0 mm surface-mount package. It is reflow solder compatible a high SNR and flat wideband frequency response, resulting in with no sensitivity degradation. The ADMP401 is halide free. natural sound with high intelligibility. Low current consumption 1 Protected by U.S. Patents 7,449,356 7,825,484 7,885,423 7,961,897. Other patents are pending. Rev. E Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Fax: 781.461.3113 20102012 Analog Devices, Inc. All rights reserved. OBSOLETE 07712-001ADMP401 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Connecting the ADMP401 to a Codec ......................................8 Applications ....................................................................................... 1 Connecting the ADMP401 to an Op Amp Gain Stage ............8 Functional Block Diagram .............................................................. 1 Supporting Documents ................................................................8 General Description ......................................................................... 1 Handling Instructions .......................................................................9 Revision History ............................................................................... 2 Pick-and-Place Equipment ..........................................................9 Specifications ..................................................................................... 3 Reflow Solder .................................................................................9 Absolute Maximum Ratings ............................................................ 4 Board Wash ....................................................................................9 ESD Caution .................................................................................. 4 Reliability Specifications ................................................................ 10 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 11 Printed Circuit Board (PCB) Land Pattern Layout ...................... 6 Ordering Guide .......................................................................... 11 Typical Performance Characteristics ............................................. 7 Applications Information ................................................................ 8 REVISION HISTORY 7/12Rev. D to Rev. E 8/11Rev. B to Rev. C Changes to Features Section, General Description Section, and Changes to Figure 1 ........................................................................... 1 Page 1 Layout .................................................................................... 1 Changes to Table 3 ............................................................................. 4 Add Note 1 ......................................................................................... 1 Removed Terminal Side Down from Figure 3 ............................... 5 Changes to Frequency Response Parameter, Table 1 and Powers Changes to Bullet 2 in Pick-and-Place Equipment Section ......... 9 Supply Rejection Parameter, Table 1 .............................................. 3 Changes to Ordering Guide .......................................................... 11 Changes to Temperature Range Parameter, Table 2 ..................... 4 Changes to Figure 6, Figure 7, and Figure 8.................................. 7 12/10Rev. A to Rev. B Changes to Applications Information Section and Figure 10..... 8 Changes to Applications and General Description Sections ....... 1 Added Supporting Documents Section, Application Notes Changes to Table 1 ............................................................................. 3 Section, Circuit Notes Section, and Evaluation Board User Guides Section .................................................................................. 8 8/10Rev. 0 to Rev. A Changes to THB Description Column, Table 5 and Temperature Changes to Frequency Response Parameter, Table 1 .................... 3 Cycle Column, Table 5 ................................................................... 10 Changes to Supply Voltage Parameter, Table 2 .............................. 4 Changes to Ordering Guide .......................................................... 11 Changes to Applications Information Section, Figure 9, and Figure 10 ............................................................................................. 8 1/12Rev. C to Rev. D Updated Outline Dimensions ....................................................... 11 Updated Outline Dimensions ....................................................... 11 Changes to Figure 12 ...................................................................... 11 4/10Revision 0: Initial Version Added Figure 13 .............................................................................. 11 Change to Ordering Guide ............................................................ 11 Rev. E Page 2 of 12 OBSOLETE

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