Support & Product Order Tools & Technical Community Folder Now Documents Software CD40106B SCHS097FNOVEMBER 1998REVISED MARCH 2017 CD40106B CMOS Hex Schmitt-Trigger Inverters 1 Features 3 Description The CD40106B device consists of six Schmitt-Trigger 1 Schmitt-Trigger Inputs inputs. Each circuit functions as an inverter with Hysteresis Voltage (Typical): Schmitt-Trigger input. The trigger switches at different 0.9 V at V = 5 V points for positive- and negative-going signals. The DD difference between the positive-going voltage (V ) 2.3 V at V = 10 V P DD and the negative-going voltages (V ) is defined as N 3.5 V at V = 15 V DD hysteresis voltage (V ). H Noise Immunity Greater Than 50% The CD40106B device is supplied in ceramic No Limit On Input Rise and Fall Times packaging (J) as well as standard packaging (D, N, Standardized, Symmetrical Output Characteristics NS, PW). All CD40106B devices are rated for 55C to +125C ambient temperature operation. For Quiescent Current at 20 V Maximum Input Current Of 1 A at 18 V Over Full (1) Device Information Package Temperature Range: PART NUMBER PACKAGE BODY SIZE (NOM) 100 nA at 18 V and 25C CD40106BF CDIP (14) 6.92 mm x 19.94 mm Low V and V Current During Slow Input DD SS CD40106BE PDIP (14) 6.30 mm x 19.31 mm Ramp CD40106BM SOIC (14) 3.90 mm x 8.65 mm 5-V, 10-V, and 15-V Parametric Ratings CD40106BNSR SO (14) 5.30 mm x 10.20 mm CD40106BPWR TSSOP (14) 4.40 mm x 5.00 mm 2 Applications (1) For all available packages, see the orderable addendum at Wave and Pulse Shapers the end of the data sheet. High-Noise-Environment Systems Monostable Multivibrators Astable Multivibrators Logic Diagram A G 1 (3, 5, 9, 11, 13) 2 (4, 6, 8, 10, 12) V DD V SS Copyright 2017, Texas Instruments Incorporated All inputs protected by the protection network shown to the right 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.CD40106B SCHS097FNOVEMBER 1998REVISED MARCH 2017 www.ti.com Table of Contents 8.3 Feature Description ................................................ 13 1 Features.................................................................. 1 8.4 Device Functional Modes........................................ 13 2 Applications........................................................... 1 9 Application and Implementation........................ 14 3 Description............................................................. 1 9.1 Application Information .......................................... 14 4 Revision History..................................................... 2 9.2 Typical Applications................................................ 14 5 Pin Configuration and Functions......................... 3 10 Power Supply Recommendations..................... 16 6 Specifications......................................................... 4 11 Layout................................................................... 16 6.1 Absolute Maximum Ratings...................................... 4 11.1 Layout Guidelines ................................................ 16 6.2 ESD Ratings ............................................................ 4 11.2 Layout Example.................................................... 16 6.3 Recommended Operating Conditions....................... 4 12 Device and Documentation Support................. 18 6.4 Thermal Information.................................................. 4 12.1 Receiving Notification of Documentation Updates 18 6.5 Electrical Characteristics: Static................................ 5 12.2 Community Resources.......................................... 18 6.6 Electrical Characteristics: Dynamic........................... 8 12.3 Trademarks........................................................... 18 6.7 Typical Characteristics.............................................. 9 12.4 Electrostatic Discharge Caution............................ 18 7 Parameter Measurement Information................ 11 12.5 Glossary................................................................ 18 8 Detailed Description............................................ 13 13 Mechanical, Packaging, and Orderable 8.1 Overview ................................................................ 13 Information........................................................... 18 8.2 Functional Block Diagram....................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (September 2016) to Revision F Page Changed incorrect pin descriptions to match package drawing ............................................................................................ 3 Changes from Revision D (August 2003) to Revision E Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.................................................................................................. 1 Added Thermal Information table........................................................................................................................................... 4 2 Submit Documentation Feedback Copyright 19982017, Texas Instruments Incorporated Product Folder Links: CD40106B