Micropower, 3-Axis, 2 g/4 g/8 g Digital Output MEMS Accelerometer Data Sheet ADXL362 FEATURES GENERAL DESCRIPTION Ultralow power The ADXL362 is an ultralow power, 3-axis MEMS accelerometer Power can be derived from coin cell battery that consumes less than 2 A at a 100 Hz output data rate and 1.8 A at 100 Hz ODR, 2.0 V supply 270 nA when in motion triggered wake-up mode. Unlike 3.0 A at 400 Hz ODR, 2.0 V supply accelerometers that use power duty cycling to achieve low power 270 nA motion activated wake-up mode consumption, the ADXL362 does not alias input signals by 10 nA standby current undersampling it samples the full bandwidth of the sensor at all High resolution: 1 mg/LSB data rates. Built-in features for system-level power savings: The ADXL362 always provides 12-bit output resolution 8-bit Adjustable threshold sleep/wake modes for motion formatted data is also provided for more efficient single-byte activation transfers when a lower resolution is sufficient. Measurement Autonomous interrupt processing, without need for ranges of 2 g, 4 g, and 8 g are available, with a resolution of microcontroller intervention, to allow the rest of the 1 mg/LSB on the 2 g range. For applications where a noise level system to be turned off completely lower than the normal 550 g/Hz of the ADXL362 is desired, Deep embedded FIFO minimizes host processor load either of two lower noise modes (down to 175 g/Hz typical) Awake state output enables implementation of can be selected at minimal increase in supply current. standalone, motion activated switch In addition to its ultralow power consumption, the ADXL362 Low noise down to 175 g/Hz has many features to enable true system level power reduction. Wide supply and I/O voltage ranges: 1.6 V to 3.5 V It includes a deep multimode output FIFO, a built-in micropower Operates off 1.8 V to 3.3 V rails temperature sensor, and several activity detection modes including Acceleration sample synchronization via external trigger adjustable threshold sleep and wake-up operation that can run On-chip temperature sensor as low as 270 nA at a 6 Hz (approximate) measurement rate. A SPI digital interface pin output is provided to directly control an external switch when Measurement ranges selectable via SPI command activity is detected, if desired. In addition, the ADXL362 has Small and thin 3 mm 3.25 mm 1.06 mm package provisions for external control of sampling time and/or an APPLICATIONS external clock. Hearing aids The ADXL362 operates on a wide 1.6 V to 3.5 V supply range, Home healthcare devices and can interface, if necessary, to a host operating on a separate, Motion enabled power save switches lower supply voltage. The ADXL362 is available in a 3 mm Wireless sensors 3.25 mm 1.06 mm package. Motion enabled metering devices FUNCTIONAL BLOCK DIAGRAM V V S DDI/O INT1 INT2 3-AXIS MEMS DIGITAL 12-BIT MOSI SENSOR LOGIC, ADC FIFO, MISO AND SPI CS SCLK AXIS ANTIALIASING DEMODULATORS FILTERS TEMPERATURE ADXL362 SENSOR GND Figure 1. Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20122019 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 10776-001ADXL362 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Device ID Register ..................................................................... 24 Applications ....................................................................................... 1 Device ID: 0x1D Register .......................................................... 24 General Description ......................................................................... 1 Part ID: 0xF2 Register ................................................................ 24 Functional Block Diagram .............................................................. 1 Silicon Revision ID Register ..................................................... 24 Revision History ............................................................................... 3 X-Axis Data (8 MSB) Register .................................................. 24 Specifications ..................................................................................... 4 Y-Axis Data (8 MSB) Register .................................................. 24 Absolute Maximum Ratings ............................................................ 6 Z-Axis Data (8 MSB) Register .................................................. 24 Thermal Resistance ...................................................................... 6 Status Register ............................................................................. 25 Package Information .................................................................... 6 FIFO Entries Registers ............................................................... 26 Recommended Soldering Profile ............................................... 6 X-Axis Data Registers ................................................................ 26 ESD Caution .................................................................................. 6 Y-Axis Data Registers ................................................................ 26 Pin Configuration and Function Descriptions ............................. 7 Z-Axis Data Registers ................................................................ 26 Typical Performance Characteristics ............................................. 8 Temperature Data Registers ...................................................... 26 Theory of Operation ...................................................................... 13 Soft Reset Register ...................................................................... 26 Mechanical Device Operation .................................................. 13 Activity Threshold Registers ..................................................... 27 Operating Modes ........................................................................ 13 Activity Time Register ............................................................... 27 Selectable Measurement Ranges ............................................... 13 Inactivity Threshold Registers .................................................. 27 Selectable Output Data Rates .................................................... 13 Inactivity Time Registers ........................................................... 27 Power/Noise Tradeoff ................................................................ 14 Activity/Inactivity Control Register ........................................ 29 Power Savings Features .................................................................. 15 FIFO Control Register ............................................................... 30 Ultralow Power Consumption in All Modes .......................... 15 FIFO Samples Register .............................................................. 31 Motion Detection ....................................................................... 15 INT1/INT2 Function Map Registers ....................................... 31 FIFO ............................................................................................. 17 Filter Control Register ............................................................... 33 Communications ........................................................................ 17 Power Control Register.............................................................. 34 Additional Features ........................................................................ 18 Self Test Register ......................................................................... 35 Free Fall Detection ..................................................................... 18 Applications Information .............................................................. 36 External Clock ............................................................................ 18 Application Examples ................................................................ 36 Synchronized Data Sampling .................................................... 18 Power............................................................................................ 37 Self Test ........................................................................................ 18 FIFO Modes ................................................................................ 38 User Register Protection ............................................................ 18 Interrupts ..................................................................................... 39 Temperature Sensor ................................................................... 18 Using Synchronized Data Sampling ........................................ 40 Serial Communications ................................................................. 19 Using an External Clock ............................................................ 41 SPI Commands ........................................................................... 19 Using Self Test ............................................................................. 41 Multibyte Transfers .................................................................... 19 Mechanical Considerations for Mounting .............................. 41 Invalid Addresses and Address Folding .................................. 19 Operation at Voltages Other Than 2.0 V ................................ 41 Latency Restrictions ................................................................... 19 Axes of Acceleration Sensitivity ............................................... 42 Invalid Commands ..................................................................... 19 Layout and Design Recommendations ................................... 42 Register Map .................................................................................... 23 Outline Dimensions ....................................................................... 43 Register Details ............................................................................... 24 Ordering Guide .......................................................................... 43 Rev. F Page 2 of 43