PPrroduct Goduct Guideuide Product Guide D 1113F Series, Right Angle InGaN/SiC SMT LED D 1113F Series, Right Angle InGaN/SiC SMT LED Features Applications High brightness (InGaN/SiC) die material Portable phone LCD edgelight Available in green (525nm), bluish-green (505nm) and blue (470nm) colors Reflow and dip soldering compatible Wide 130 degree viewing angle 1000V minimum ESD protection Outline Dimensions Cathode Mark Cathode Unit: mm Tolerances + 0.1 Electro-Optical Characteristics (Ta=25C) Luminous Forward Part No. Material Emitted Lens Wavelength Reverse Viewing Spectral Line Color Intensity I Voltage VF Current I Color Angle V R Peak Dominant Half Width p d (2 1/2) R MIN. TYP. IF TYP. MAX. IF MAX. V TYP. TYP. TYP. IF DG1113F InGaN/SiC Green 24 40 10 522 525 30 10 3.3 3.8 10 100 5 Milky DC1113F InGaN/SiC Bluish-Green 24 34 10 502 505 30 10 3.3 3.8 10 100 5 130 White DB1113F InGaN/SiC Blue 8.5 14 10 467 470 26 10 3.3 3.8 10 100 5 Units mcd mA nm mA V mA A V Deg.~ LED Surface Temperature Absolute Maximum Ratings (Ta=25C) Green Bluish-Green Blue Units Item Symbol DG DC DB 76 76 76 mW Power Dissipation Pd 20 20 20 mA Forward Current IF mA Peak Forward Current 48 48 48 IFM V Reverse Voltage 5 5 5 VR C Operating Temperature -40 to +85 Topr Storage Temperature C -40 to +100 Tstg mA/C Derating* 0.28 (DC) 0.69 (Pulse) IF * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. Taping Specifications (0.2) 4+0.1 Operation Current Derating Chart (DC) +0.1 1.5 (1.1) 0 Center Hole Quantity on tape: 4000 pieces per reel 2+0.05 ( 0.6) (0.8) Center Hole 2+0.5 21+0.8 4+0.1 Direction to pull 13+0.2 DG, DC, DB, 9+0.3 +0 11.4+1 180 3 Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. Reflow Soldering: C Operation Heating Spatial Distribution 240 Temperature Cooling: 150 rise: 5C/sec. 5C/sec. Pre-heating 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGD1113F-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 Tel: 800-LED-LCD1 (533-5231) Fax: 949-222-0555 Website: www.stanley-electric.com 1.75+0.1 3.5+0.05 8+0.2 (2.2) +1 60 -0 13+0.2