Stannol 810028 is a tin-based solder paste formulated for reflow soldering of electronic components. It has been designed to be used in a multitude of applications, such as SMT, BGA and CSP. This solder paste has an aluminum-copper surface finish that is ideal for high temperature applications. It also contains a natural rosin flux, which helps to reduce the occurrence of excess oxidation and improves the wettability of the solder paste. The flux residue is non-conductive, non-corrosive and non-ionic for a cleanworking environment. Additionally, it is compatible with most electronic component materials and finishes, making it suitable for a wide variety of applications. Stannol 810028 has excellent wetting properties, forming a strong bond between the terminal and component. It has a low-spatter, non-flammable composition and it is halide-free, making it a safe and reliable choice.