MP45DT02TR-M STMicroelectronics

MP45DT02-M MEMS audio sensor omnidirectional digital microphone Datasheet - production data Description The MP45DT02-M is a compact, low-power, top- port, omnidirectional, digital MEMS microphone. The MP45DT02-M is built with a sensing element and an IC interface with stereo capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM Features format. Single supply voltage The MP45DT02-M has an acoustic overload Low power consumption point of 120 dBSPL with a best on the market 120 dBSPL acoustic overload point 61 dB signal-to-noise ratio and -26 dB sensitivity. Omnidirectional sensitivity The MP45DT02-M is available in an SMD- PDM single-bit output with option for stereo compliant metal package and is guaranteed to configuration operate over an extended temperature range HLGA metal package (SMD-compliant) from -30 C to +85 C. ECOPACK , RoHS, and Green compliant The MP45DT02-Ms digital output and package size (1.25 mm thick) make this device the best Applications solution for laptop and portable computing Mobile terminals applications. Laptop and notebook computers Table 1: Device summary Portable media players Order code Temp. range C Package Packing VoIP Speech recognition HLGA MP45DT02TR-M -30 to +85 Tape and reel A/V eLearning devices 4.72 x 3.76 6LD Gaming and virtual reality input devices Digital still and video cameras Antitheft systems June 2016 DocID029435 Rev 1 1/16 www.st.com This is information on a product in full production. Contents MP45DT02-M Contents 1 Pin description ................................................................................ 5 2 Acoustic and electrical specifications ........................................... 6 2.1 Acoustic and electrical characteristics ............................................... 6 2.2 Timing characteristics ....................................................................... 7 2.3 Frequency response ......................................................................... 8 3 Sensing element .............................................................................. 9 4 Absolute maximum ratings ........................................................... 10 5 Functionality .................................................................................. 11 5.1 L/R channel selection ...................................................................... 11 6 Application recommendations ..................................................... 12 7 Package information ..................................................................... 13 7.1 Soldering information ...................................................................... 13 7.2 HLGA (4.72 x 3.76 mm) 6L (metal) package information ................ 14 8 Revision history ............................................................................ 15 2/16 DocID029435 Rev 1