TS922IN STMicroelectronics

TS922, TS922A Rail-to-rail, high output current, dual operational amplifier Datasheet - production data Applications Headphone and servo amplifiers Sound cards, multimedia systems Line drivers, actuator drivers Mobile phones and portable equipment Instrumentation with low noise as key factor Piezoelectric speaker drivers Description TS922 and TS922A devices are rail-to-rail dual BiCMOS operational amplifiers optimized and fully specified for 3 V and 5 V operation. These devices have high output currents which allow low-load impedances to be driven. Very low noise, low distortion, low offset, and a high output current capability make these devices an excellent choice for high quality, low voltage, or battery operated audio systems. The devices are stable for capacitive loads up to 500 pF. Features Rail-to-rail input and output Low noise: 9 nV/Hz Low distortion High output current: 80 mA (able to drive 32 loads) High-speed: 4 MHz, 1 V/s Operating from 2.7 to 12 V Low input offset voltage: 900 V max. (TS922A) ESD internal protection: 2 kV Latch-up immunity Macromodel included in this specification Dual version available in Flip-chip package January 2016 DocID5150 Rev 12 1/22 www.st.com This is information on a product in full production. Contents TS922, TS922A Contents 1 Pin diagrams .................................................................................... 3 2 Absolute maximum ratings and operating conditions ................. 4 3 Electrical characteristics ................................................................ 6 4 Electrical characteristic curves .................................................... 10 5 TS922, TS922A macromodel ......................................................... 12 5.1 Important note concerning this macromodel ................................... 12 5.2 Electrical characteristics from macromodelization ........................... 12 5.3 Macromodel code ............................................................................ 13 6 Package information ..................................................................... 15 6.1 8-bump Flip-chip package information ............................................ 16 6.2 SO8 package information ................................................................ 18 6.3 TSSOP8 package information ......................................................... 19 7 Ordering information ..................................................................... 20 8 Revision history ............................................................................ 21 2/22 DocID5150 Rev 12