Manufacturing Company
GP1607 is a silicon wafer fabrication facility (or "FAB") located in Hsinchu, Taiwan and operated by Taiwan Semiconductor Manufacturing Company (TSMC). It is a 300 mm wafer facility consisting of 200,000 square-meter cleanroom space and uses advanced lithography equipment in an enhanced production environment. GP1607 is used to manufacture a range of semiconductor products and discrete components using the most advanced wafer fabrication processes. Its production spans a large part of the semiconductor industry, including various flash memory types, high frequency RF components, power semiconductor, analog and logic ICs, logic and embedded processors, display driver ICs, among others. The facility also supports 3D integration technology, advanced design and package development, and is capable of developing new process technologies and applications in collaboration with customers.