Manufacturing
MBS2 is an advanced wafer fabrication facility operated by Taiwan Semiconductor Manufacturing Company (TSMC). It is located in Hsinchu, Taiwan, and is part of their 12-inch (0.3 micron) Advanced Hi-K/Metal Gate wafer fabrication process. MBS2 is capable of producing chips with a variety of process nodes and is approved for automotive, consumer, RF power, server and application processors. It is also ISO/TS 16949 certified. In addition, MBS2 has equipment specifically designed to support the latest design architectures, including FinFET, SRAM, High-K/Metal Gate, and advanced lithography such as EUV. The facility also has a wide range of on-site testing and packaging capabilities.