MBS8 RC Taiwan Semiconductor

creat by art MBS2 - MBS10 Single Phase 0.8 AMP Glass Passivated Bridge Rectifiers MBS RoHSRoHS Pb COCOMMPPLLIIANCANCEE Features UL Recognized File E-326243 Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High surge current capability High temperature soldering guaranteed: 260/10 seconds at 5 lbs., (2.3kg) tension Small size, simple installation Green compound with suffix on packing code & prefix on datecode Mechanical Data Case: Molded plastic body Dimensions in inches and (millimeters) Terminal: Leads solderable per MIL-STD-202 Method 208 Marking Diagram Weight: 0.123 grams MBSX = Specific Device Code G = Green Compound Y = Year M = Work Month Maximum Ratings and Electrical Characteristics Rating at 25 ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% MBS2 MBS4 Type Number Symbol MBS6 MBS8 MBS10 Unit Maximum Repetitive Peak Reverse Voltage V 200 400 600 800 1000 V RRM Maximum RMS Voltage V 140 280 420 560 700 V RMS Maximum DC Blocking Voltage V 200 400 600 800 1000 V DC Maximum Average Forward Rectified Current I On glass-epoxy P.C.B. 0.5 A F(AV) On aluminum substrate 0.8 Peak Forward Surge Current, 8.3 ms Single Half Sine- I 35 A FSM wave Superimposed on Rated Load (JEDEC method) Maximum Instantaneous Forward Voltage (Note 1) V 1.0 V F 0.4A 5 Maximum DC Reverse Current T =25 A I uA R at Rated DC Blocking Voltage T =125 100 A 2 2 Rating of fusing ( t<8.3ms) 5.08 ITA S Typical Junction Capacitance Per Leg (Note 2) 13 Cj pF R (Note 3) jA 85 O R Typical Thermal Resistance (Note 4) 70 jA C/W (Note 3) 20 R jL O Operating Temperature Range T - 55 to + 150 C J O Storage Temperature Range T - 55 to + 150 C STG Note 1: Pulse Test with PW=300 usec,1% Duty Cycle Note 2: Measure at 1.0MHz and Applied Reverse Voltage of 4.0 Volts D.C. Note 3: On glass epoxy P.C.B. mounted on 0.05 x 0.05 (1.3mm x 1.3mm) pads Note 4: On aluminum substrate P.C.B. with an area of 0.8 x 0.8 (20mm x 20mm) mounted on 0.05 x 0.05 (1.3mm x 1.3mm) solder pads Version:I12RATINGS AND CHARACTERISTIC CURVES (MBS2 THRU MBS10) FIG. 2 TYPICAL REVERSE CHARACTERISTICS FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE PER LEG 100 1 RESISTIVE OR INDUCTIVE 0.8 Aluminum Substrate 10 TA=125 0.6 1 0.4 0.1 Glass Epoxy P.C.B. 0.2 TA=25 0.01 0 0 2040 6080 100 0 20 40 60 80 100 120 140 160 o PERCENT OF RATED PEAK REVERSE VOLYAGE(%) AMBIENT TEMPERATURE ( C) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD FIG. 4 TYPICAL JUNCTION CAPACITANCE SURGE CURRENT PER LEG PER LEG 35 30 Single Half Sine-Wave 30 (JEDEC Method) 25 25 20 F=60Hz 20 15 15 F=50Hz TA=25 10 10 f=1.0MHz Vslg=50mVp-p 5 5 0 0 0.1 1 10 100 1 10 100 NUMBER OF CYCLES AT 60 Hz REVERSE VOLTAGE (V) FIG. 5 TYPICAL FORWARD CHARACTERISTICS PER LEG 10 1 TA=25 0.1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 FORWARD VOLTAGE (V) Version:I12 AVERAGE FORWARD a PEAK FORWARD SURGE A INSTANTANEOUS FORWARD A CURRENT (A) CURRENT (A) CURRENT (A) INSTANTANEOUS REVERSE A CURRENT (uA) CAPACITANCE (pF) a