Complementary wireless module WLAN / BT Standard Laminate SiP Module Series/Type: R078 (WL1837) / D7020 Ordering code: B30931D7020Y918 Date: 2014-12-9 Version: 1.3 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers Please fill in the table and then change the color towhit. This ensures that the table disappears (invisible) for the customer PDF. Don t change formatting when entering or pasting text in the table and don t add any cell or line in and to it Identification/Classification 1 Complementary wireless module WLAN / BT (header 1 + top left bar): Identification/Classification 2 Standard Laminate SiP Module (header 2 + bottom left header bar): Ordering code: (top right header bar) B30931D7020Y918 Series/Type: (bottom right header bar) R078 (WL1837) / D7020 Preliminary data (optional): (if necessary) Department: SAW IT Date: 2014-12-9 Version: 1.3 EPCOS AG 2014. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS prior express consent is prohibited. Complementary wireless module WLAN / BT B30931D7020Y918 Standard Laminate SiP Module R078 (WL1837) / D7020 1. Overview This document details the specifications and features of R078 (WL1837) / D7020 SiP module. The R078 (WL1837) / D7020 SiP module is based on Texas Instruments WL1837 IC, specifically WL183x Data Sheet version 1.4, such that the SiP module specification is subject to any subsequent changes in applicable Texas Instruments documentation and software. The R078 (WL1837) / D7020 contains the WL1837 SoC, 2.4GHz and 5 GHz SPDT switches, 2.4GHz and 5GHz band pass filters / diplexer and necessary passive components for WLAN and BT in a highly integrated solution. 1.1 Features WLAN, BT, BLE on a single chip provide universal connectivity in small PCB footprint. Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC). Based on 45nm CMOS technology using proven core technology. Seamless integration with TI OMAP Application Processors. WLAN and Bluetooth cores software and hardware are compatible with prior WL127x and WL128x offerings, for smooth migration to Device. Shared HCI transport for BT/BLE over UART and SDIO for WLAN. Downloadable patches and firmware enables new features to be added for all functional block s. Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the entire temperature range. Bluetooth 4.0, BLE and all audio processing features work in parallel and include full coexistence with WLAN 1.2 Applications Mobile phone and mobile computer device applications. 1.3 General Description The R078 (WL1837) / D7020 is a highly integrated WLAN, BT, BLE device that forms a complete standalone communication system. The WL1837 is a highly integrated single-chip CMOS (45-nm process) incorporates the core functionality of the WL1271/3 and WL1281/3 devices. The device is the 8th-generation WLAN/BT/BLE devices from Texas Instruments. As such, the WL1837 is based upon proven core technology and complements the TI integrated devices for connectivity portfolio. R078 (WL1837) / D7020 is ideal for use in mobile phone and mobile computer device applications due to its low current, small area and cellular phone coexistence-friendly features. SAW IT 2014-12-9 Please read Cautions and warnings and Page 2 of 51 Important notes at the end of this document.