Temperature Measurement B57621 SMD NTC Thermistors with Silver Palladium Termination, Size 1206 C621 Applications 1,60,2 1,3 max. Temperature measurement and compensation in hybrid circuits data systems telecom systems automotive electronics Features Silver palladium termination (AgPd) Cost-effective Suitable for wave and reflow soldering Termination TNT0398-F Options Dimensions in mm/Approx. weight 18 mg Alternative resistance ratings and resistance tolerance < 5% available on request Delivery mode Blister tape, 180-mm reel, PU: 4000 or 2000 pcs, depending on chip thickness Climatic category (IEC 60068-1) 55/125/21 Max. power at 25 C (on PCB) P 300 mW 25 Resistance tolerance R /R 5 %, 10 %, 20 % N N Rated temperature T 25 C N B value tolerance B/B 3 % 1) Dissipation factor (on PCB) approx. 5 mW/K th 1) Thermal cooling time constant (on PCB) approx. 10 s c 1) Heat capacity C approx. 50 mJ/K th R No. of R/T B B B Ordering code 25 25/50 25/85 25/100 characteristic K K K 2,2 k 1308 3010 3040 3060 B57621C0222+062 3,3 k 1309 3430 3500 3520 B57621C0332+062 4,7 k 1309 3430 3500 3520 B57621C0472+062 10 k 1010 3470 3510 3530 B57621C0103+062 15 k 1008 3480 3550 3560 B57621C0153+062 22 k 1008 3480 3550 3560 B57621C0223+062 33 k 2003 3930 3960 3980 B57621C0333+062 47 k 2001 3860 3890 3920 B57621C0473+062 68 k 2001 3860 3890 3920 B57621C0683+062 +: J for R /R = 5 % N N Kfor R /R = 10 % N N Mfor R /R = 20 % N N 1) Depends on mounting situation 60 05/02 3,20,2 0,50,25Temperature Measurement B57621 SMD NTC Thermistors with Silver Palladium Termination, Size 1206 C621 R No. of R/T B B B Ordering code 25 25/50 25/85 25/100 characteristic K K K 100 k 4901 3870 3930 3950 B57621C0104+062 150 k 2903 4120 4190 4200 B57621C0154+162 220 k 2903 4120 4190 4200 B57621C0224+062 330 k 1014 4090 4210 4250 B57621C0334+062 470 k 1014 4090 4210 4250 B57621C0474+062 +: J for R /R = 5 % N N Kfor R /R = 10 % N N Mfor R /R = 20 % N N Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Standard Test conditions R /R Remarks 25 25 (typical) Storage in IEC Storage at upper < 3 % dry heat 60068-2-2 category temperature JIS C 0021 T: (125 2) C t: 1000 h Storage in damp IEC Temperature of air: (40 2) C < 3 % No visible heat, steady state 60068-2-3 Relative humidity of air: damage JIS C 0022 (93 +2/3) % Duration: 21 days Rapid temperature IEC Lower test temperature: 55 C < 3 % cycling 60068-2-14 Upper test temperature: 125 C JIS C 0025 Number of cycles: 10 Endurance P : 300 mW < 5 % max T: (65 2) C t: 1000 h Solderability IEC Solderability: 95 % of 60068-2-58 (215 3) C / (3 0,3) s terminations JIS C 0054 (235 5) C / (2 0,2) s wetted Resistance to soldering heat: (260 5) C / (10 1) s Resistance drift Reflow soldering profile < 5 % after soldering Wave soldering profile 61 05/02