X-On Electronics has gained recognition as a prominent supplier of EV_IXZ-2510 Multiple Function Sensor Development Tools across the USA, India, Europe, Australia, and various other global locations. EV_IXZ-2510 Multiple Function Sensor Development Tools are a product manufactured by TDK. We provide cost-effective solutions for Multiple Function Sensor Development Tools, ensuring timely deliveries around the world.

EV_IXZ-2510 TDK

EV_IXZ-2510 electronic component of TDK
Images are for reference only
See Product Specifications
Part No.EV_IXZ-2510
Manufacturer: TDK
Category: Multiple Function Sensor Development Tools
Description: The IXZ-2510 is a single-chip, digital output, 2 Axis MEMS gyroscope IC which features a 512-byte FIFO
Datasheet: EV_IXZ-2510 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 79.7245 ea
Line Total: USD 79.72

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 01 Aug to Wed. 07 Aug
MOQ : 1
Multiples : 1
1 : USD 89.2915

   
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We are delighted to provide the EV_IXZ-2510 from our Multiple Function Sensor Development Tools category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the EV_IXZ-2510 and other electronic components in the Multiple Function Sensor Development Tools category and beyond.

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InvenSense Inc. Document Number: PS-IXZ-2510A-00 1745 Technology Drive, San Jose, CA 95110 U.S.A. Revision: 1.1 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Release Date: 9/23/2016 Website: www.invensense.com IXZ-2510 Product Specification Revision 1.1 1 of 46 Document Number: PS-IXZ-2510A-00 Revision: 1.1 IXZ-2510 Product Specification Release Date: 9/23/2016 CONTENTS 1 DOCUMENT INFORMATION ..................................................................................................................... 4 1.1 REVISION HISTORY ................................................................................................................................. 4 1.2 PURPOSE AND SCOPE ............................................................................................................................ 5 1.3 PRODUCT OVERVIEW.............................................................................................................................. 5 1.4 APPLICATIONS ........................................................................................................................................ 5 2 FEATURES ................................................................................................................................................. 6 2.1 SENSORS ............................................................................................................................................... 6 2.2 DIGITAL OUTPUT .................................................................................................................................... 6 2.3 DATA PROCESSING ................................................................................................................................ 6 2.4 CLOCKING .............................................................................................................................................. 6 2.5 POWER .................................................................................................................................................. 6 2.6 PACKAGE ............................................................................................................................................... 6 3 ELECTRICAL CHARACTERISTICS .......................................................................................................... 7 3.1 SENSOR SPECIFICATIONS ....................................................................................................................... 7 3.2 ELECTRICAL SPECIFICATIONS.................................................................................................................. 8 3.3 ELECTRICAL SPECIFICATIONS, CONTINUED .............................................................................................. 9 2 3.4 I C TIMING CHARACTERIZATION ............................................................................................................ 10 3.5 SPI TIMING CHARACTERIZATION ........................................................................................................... 11 3.6 ABSOLUTE MAXIMUM RATINGS .............................................................................................................. 12 4 APPLICATIONS INFORMATION ............................................................................................................. 13 4.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................... 13 4.2 TYPICAL OPERATING CIRCUIT ............................................................................................................... 14 4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ................................................................................. 14 5 FUNCTIONAL OVERVIEW ....................................................................................................................... 15 5.1 BLOCK DIAGRAM .................................................................................................................................. 15 5.2 OVERVIEW ........................................................................................................................................... 15 5.3 DUAL-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING .................................... 15 2 5.4 I C AND SPI SERIAL COMMUNICATIONS INTERFACE ............................................................................... 15 5.5 INTERNAL CLOCK GENERATION ............................................................................................................. 16 5.6 SENSOR DATA REGISTERS ................................................................................................................... 16 5.7 FIFO ................................................................................................................................................... 16 5.8 INTERRUPTS ......................................................................................................................................... 16 5.9 DIGITAL-OUTPUT TEMPERATURE SENSOR ............................................................................................. 16 5.10 BIAS AND LDO ..................................................................................................................................... 16 6 DIGITAL INTERFACE ............................................................................................................................... 17 2 6.1 I C SERIAL INTERFACE ......................................................................................................................... 17 7 SERIAL INTERFACE CONSIDERATIONS .............................................................................................. 22 7.1 SUPPORTED INTERFACES ..................................................................................................................... 22 7.2 LOGIC LEVELS ...................................................................................................................................... 22 8 ASSEMBLY ............................................................................................................................................... 23 8.1 ORIENTATION OF AXES ......................................................................................................................... 23 8.2 PACKAGE DIMENSIONS ......................................................................................................................... 24 8.3 PACKAGE MARKING SPECIFICATION ...................................................................................................... 25 2 of 46

Tariff Desc

8543.70.00 - Other machines and apparatus Free
13 No Signal processors (graphic equalisers, crossovers etc.)
91 .. Other

9027.10.00 Instruments and apparatus for physical or chemical analysis (for example, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes.
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