X-On Electronics has gained recognition as a prominent supplier of IXZ-2510 Gyroscopes across the USA, India, Europe, Australia, and various other global locations. IXZ-2510 Gyroscopes are a product manufactured by TDK. We provide cost-effective solutions for Gyroscopes, ensuring timely deliveries around the world.

IXZ-2510 TDK

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Part No.	IXZ-2510
Manufacturer:	TDK
Category:	Gyroscopes
Description:	2-axis Gyroscope for Motion Applications
Datasheet:	IXZ-2510 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

IXZ-2510 More Buying Options & Price Grid(s)

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Specifications

Manufacturer TDK TDK
Product Category Gyroscopes Gyroscopes

We are delighted to provide the IXZ-2510 from our Gyroscopes category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IXZ-2510 and other electronic components in the Gyroscopes category and beyond.

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Additional Infomation About Product

InvenSense Inc. Document Number: PS-IXZ-2510A-00 1745 Technology Drive, San Jose, CA 95110 U.S.A. Revision: 1.0 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Release Date: 12/24/2013 Website: www.invensense.com IXZ-2510 Product Specification Revision 1.0 Confidential & Proprietary 1 of 46 Document Number: PS-IXZ-2510A-00 Revision: 1.0 IXZ-2510 Product Specification Release Date: 12/24/2013 CONTENTS 1 DOCUMENT INFORMATION ..................................................................................................................... 4 1.1 REVISION HISTORY ................................................................................................................................. 4 1.2 PURPOSE AND SCOPE ............................................................................................................................ 5 1.3 PRODUCT OVERVIEW.............................................................................................................................. 5 1.4 APPLICATIONS ........................................................................................................................................ 5 2 FEATURES ................................................................................................................................................. 6 2.1 SENSORS ............................................................................................................................................... 6 2.2 DIGITAL OUTPUT .................................................................................................................................... 6 2.3 DATA PROCESSING ................................................................................................................................ 6 2.4 CLOCKING .............................................................................................................................................. 6 2.5 POWER .................................................................................................................................................. 6 2.6 PACKAGE ............................................................................................................................................... 6 3 ELECTRICAL CHARACTERISTICS .......................................................................................................... 7 3.1 SENSOR SPECIFICATIONS ....................................................................................................................... 7 3.2 ELECTRICAL SPECIFICATIONS.................................................................................................................. 8 3.3 ELECTRICAL SPECIFICATIONS, CONTINUED .............................................................................................. 9 2 3.4 I C TIMING CHARACTERIZATION ............................................................................................................ 10 3.5 SPI TIMING CHARACTERIZATION ........................................................................................................... 11 3.6 ABSOLUTE MAXIMUM RATINGS .............................................................................................................. 12 4 APPLICATIONS INFORMATION ............................................................................................................. 13 4.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................... 13 4.2 TYPICAL OPERATING CIRCUIT ............................................................................................................... 14 4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ................................................................................. 14 5 FUNCTIONAL OVERVIEW ....................................................................................................................... 15 5.1 BLOCK DIAGRAM .................................................................................................................................. 15 5.2 OVERVIEW ........................................................................................................................................... 15 5.3 DUAL-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING .................................... 15 2 5.4 I C AND SPI SERIAL COMMUNICATIONS INTERFACE ............................................................................... 15 5.5 INTERNAL CLOCK GENERATION ............................................................................................................. 16 5.6 SENSOR DATA REGISTERS ................................................................................................................... 16 5.7 FIFO ................................................................................................................................................... 16 5.8 INTERRUPTS ......................................................................................................................................... 16 5.9 DIGITAL-OUTPUT TEMPERATURE SENSOR ............................................................................................. 16 5.10 BIAS AND LDO ..................................................................................................................................... 16 6 DIGITAL INTERFACE ............................................................................................................................... 17 2 6.1 I C SERIAL INTERFACE ......................................................................................................................... 17 7 SERIAL INTERFACE CONSIDERATIONS .............................................................................................. 22 7.1 SUPPORTED INTERFACES ..................................................................................................................... 22 7.2 LOGIC LEVELS ...................................................................................................................................... 22 8 ASSEMBLY ............................................................................................................................................... 23 8.1 ORIENTATION OF AXES ......................................................................................................................... 23 8.2 PACKAGE DIMENSIONS ......................................................................................................................... 24 8.3 PACKAGE MARKING SPECIFICATION ...................................................................................................... 25 Confidential & Proprietary 2 of 46

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

8543.70.00 - Other machines and apparatus Free
13 Signal processors (graphic equalisers, crossovers etc.)
91 Other

9027.10.00 Instruments and apparatus for physical or chemical analysis (for example, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes.

9031.80.00 - MEASURING OR CHECKING INSTRUMENTS, APPLIANCES AND MACHINES, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER; PROFILE PROJECTORS Other instruments, appliances and machines Free"

EP9 may also be referenced as

EPC
EPCOS
EPCOS TDK
EPCOS (TDK)
EPCOS / TDK
EPCOS Inc
EPCOS/TDK
EPO
InvenSense
Micronas
Micronas GmbH
TD4
TDK Corporation
TDK ELECTRONICS
TDK INNOVETA
TDK InvenSense
TDK LAMBDA
TDK SEMICONDUCTOR
TDK-Lambda Americas Inc
TDK-Lambda Americas Inc.
TDK-Lambda Americas Inc. [CI] (VA)
TDK-Micronas
tronics
Tronics / TDK

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