Common Beads For audio/USB1.1 signal lines MCZ series Type: MCZ1210-D 1210 0504 inch * * Dimensions Code JIS EIA Issue date: November 2011 All specifications are subject to change without notice. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.(1/3) Conformity to RoHS Directive Common Beads For Audio / USB1.1 Signal Lines MCZ Series MCZ1210-D(2-Line) This is a common type bead product that removes the noise com- SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ponents in a signal line and includes beads for two lines in a single PATTERN chip. The product exhibits substantial impedance characteristics in 1.250.15 0.4 the high frequency range and is therefore capable of effectively 43 removing differential mode noises. Additionally, an appropriate amount of magnetic coupling is created between the beads of the two lines, giving the product the capability to remove not only dif- ferential mode noise but common mode noise as well. It is 12 encased in a 1210 casing. This is an SMD product that allows for automatic mounting by taping. 0.3 T Weight Dimensions in mm FEATURES 0.50.10mm 3mg Compact size, Low Rdc (0.75 max.) 0.850.15mm 4mg 0.650.15 Capable of removing both common and differential mode noises. Closed magnetic circuit structure allows high-density installation CIRCUIT DIAGRAM while preventing crosstalk between circuits. 43 APPLICATIONS Removal of audio signal line noises of cellular phones, PCs, note PCs, DSCs, portable game machines, etc. 12 PRODUCT IDENTIFICATION No polarity MCZ 1210 AD 102 T (1) (2) (3) (4) (5) (6) TEMPERATURE RANGES Operating/Storage 40 to +85C (1) Series name (2) Dimensions LW PACKAGING STYLE AND QUANTITIES Packaging style Quantity (3) Type name Taping 4000 pieces/reel (4) Open mode impedance 102:1000 at 100MHz HANDLING AND PRECAUTIONS (5) Packaging style Before soldering, be sure to preheat components. The preheat- T:Taping ing temperature should be set so that the temperature difference (6) TDK internal code between the solder temperature and product temperature does not exceed 150C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. This product does not apply to flow soldering construction method. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 001-04 / 20111129 / e9421 mcz.fm T 1.00.15 0.5 0.5