Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series Type: MLF1005L 1005 0402 inch * MLF1608 1608 0603 inch MLF2012 2012 0805 inch * Dimensions Code JIS EIA Issue date: November 2011 All specifications are subject to change without notice. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.(1/9) Conformity to RoHS Directive Inductors for Standard Circuits Multilayer/STD Magnetic Shielded MLF Series MLF1005L Various digital devices are required to be further downsized yet PRODUCT IDENTIFICATION remain highly functional, and to excel in low power consumption, MLF 1005 L R10 K T (1) (2) (3) (4) (5) (6) (7) and parts mounted on the devices are also required to have lower resistance. (1) Series name The MLF1005L type is a new line of inductors that have been developed to meet such requirements: their resistance has been (2) Dimensions L W lowered by up to 35% in comparison with that of the existing 1005 1.00.5 0.5 MLF1005 type. In addition, the new inductors use similar magnetic shielding, (3) Type name which enables their high-density mounting. L Low-resistance type FEATURES (4) Inductance The resistance of the MLF1005L type has been lowered by up to R10 0.1H 35% in comparison with that of the existing MLF1005 type. 1R0 1.0H Magnetically shielded configuration allowing for high-density mounting. (5) Tolerance Does not contain lead and is compatible with lead-free K 10% soldering. It is a product conforming to RoHS directive. (6) Packaging style T Taping reel APPLICATIONS Signal processing modules such as cellular phones and tuners (7) TDK internal code SPECIFICATIONS PACKAGING STYLE AND QUANTITIES Operating temperature range 40 to +85C Packaging style Quantity Storage temperature range 40 to +85C(After mount) Taping 10000 pieces/reel RECOMMENDED SOLDERING CONDITION HANDLING AND PRECAUTIONS REFLOW SOLDERING Before soldering, be sure to preheat components. The preheating temperature should be set so that the tempera- 10s max. ture difference between the solder temperature and product 250 to 260C temperature does not exceed 150C. Natural cooling After mounting components onto the printed circuit board, do not 230C apply stress through board bending or mishandling. The inductance value may change due to magnetic saturation if 180C the current exceeds the rated maximum. 150C Do not expose the inductors to stray magnetic fields. Preheating Soldering Avoid static electricity discharge during handling. 60 to 120s 30 to 60s When hand soldering, apply the soldering iron to the printed cir- Time(s) cuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 001-05 / 20111129 / e511 mlf 02