Inductors for Decoupling Circuits Multilayer/STD magnetic shielded MLZ series Type: MLZ1005W 1005 0402 inch * MLZ1608 1608 0603 inch MLZ2012 2012 0805 inch * Dimensions Code JIS EIA Issue date: May 2012 All specifications are subject to change without notice. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.(1/10) Conformity to RoHS Directive Inductors for Decoupling Circuits Multilayer/STD Magnetic Shielded MLZ Series MLZ1005W The MLZ Series is a new line of multilayer choke coils for decou- PRODUCT IDENTIFICATION pling with the industrys best DC superimposition characteristics MLZ 1005 M 1R0 W T (1) (2) (3) (4) (5) (6) (7) and lowest DC resistance . TDK has developed this coil using its proprietary ferrite material technique and dense electrodes. (1) Series name The MLZ Series exerts an excellent effect mainly on the decou- pling of power circuits. It also exerts an effect on audio lines (2) Dimensions L W because of its low DC resistance. 1005 1.00.5 0.5mm The MLZ1005 series is now available in addition to the MLZ1608/ 2012 series. The MLZ Series was regarded as having the industry s best DC (3) Management symbol superimposition characteristics and lowest DC resistance according to research conducted in September 2010. (4) Inductance R47 0.47 H FEATURES 1R0 1.0 H MLZ10005 series products have the best DC superimposition characteristics in the industry. (5) Characteristic type Magnetically sealed configuration allowing for high-density W IDC-UP mounting. Does not contain lead and is compatible with lead-free (6) Packaging style soldering. T Taping reel It is a product conforming to RoHS directive. (7) TDK internal code APPLICATIONS Modules such as digital cellular phone and camera module, Net- PACKAGING STYLE AND QUANTITIES books, note PCs, DSCs, DVCs, video games, portable memory Packaging style Quantity audio devices, navigation systems, PNDs, TVs, W-LANs, solid Taping 10000 pieces/reel state drives HANDLING AND PRECAUTIONS SPECIFICATIONS Before soldering, be sure to preheat components. 55 to +125C The preheating temperature should be set so that the tempera- Operating temperature range Including self-temperature rise ture difference between the solder temperature and product Storage temperature range 55 to +125C(After mount) temperature does not exceed 150C. After mounting components onto the printed circuit board, do not RECOMMENDED SOLDERING CONDITION apply stress through board bending or mishandling. REFLOW SOLDERING The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. 10s max. Do not expose the inductors to stray magnetic fields. 250 to 260C Avoid static electricity discharge during handling. Natural cooling When hand soldering, apply the soldering iron to the printed cir- 230C cuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. 180C 150C Preheating Soldering 60 to 120s 30 to 60s Time(s) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 002-06 / 20120514 / e533 mlz
