(1/4) Conformity to RoHS Directive Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES MATERIAL CHARACTERISTICS This is a multilayered chip bead product with dimensions of S material: Standard type that features impedance characteristics L0.6 W0.3T0.3mm. similar to those of a typical ferrite core. The product is magnetically shielded, allowing high density For signal line applications in which the blocking region mounting. is near 100MHz. Impedance values selected for effec- We refined the rules for internal conductor design to reduce tiveness at 40 to 300MHz. floating capacity between conductors, which in turn has Y material: High frequency range type intended for the 100MHz contributed to a dramatic improvement in high frequency region and above. characteristics. We have also been able to expand and reinforce For signal line applications in which the signal fre- the EMI suppression in the GHz range. quency is far from the cutoff frequency. Impedance val- It is a product conforming to RoHS directive. ues selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low fre- APPLICATIONS quencies and sharply increasing impedance at high Removal of signal line noises of cellular phones, portable audio frequencies. Designed for high impedance at high fre- players, various modules, DSCs, portable game machines, etc. quencies (300MHz to 1GHz) for signal line applica- tions. PRODUCT IDENTIFICATION F material: This new product inherits the characteristic of our D- MMZ 0603 S 121 C T material, namely its sharp impedance rise time, and its (1) (2) (3) (4) (5) (6) impedance peak frequency has been shifted higher into range. The product offers excellent noise suppres- (1) Series name sion from 600MHz to as high as in the GHz range. (2) Dimensions LW (3) Material code TYPICAL MATERIAL CHARACTERISTICS (4) Nominal impedance 2000 121:120 at 100MHz 1800 D (5) Characteristic type 1600 (6) Packaging style Y 1400 T:Taping 1200 1000 S HANDLING AND PRECAUTIONS 800 F Before soldering, be sure to preheat components. The preheat- 600 ing temperature should be set so that the temperature difference 400 200 between the solder temperature and product temperature does 0 not exceed 150C. 10 100 1000 After mounting components onto the printed circuit board, do not Frequency(MHz) apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application are considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 010-01 / 20101006 / e9412 mmz0603.fm ( ) Impedance(2/4) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARACTERISTICS PATTERN Impedance DC resistance Rated current Part No. ( ) 100MHz ()max. (mA)max. 0.60.03 MMZ0603S100C 105 0.12 500 MMZ0603S800C 8025% 0.37 200 MMZ0603S121C 12025% 0.45 200 MMZ0603S241C 24025% 0.75 200 0.25 0.30 0.25 MMZ0603S471C 47025% 1.30 100 0.1min. MMZ0603S601C 60025% 1.45 100 MMZ0603Y121C 12025% 0.75 200 Weight: 0.3mg MMZ0603Y241C 24025% 0.80 200 MMZ0603Y471C 47025% 1.40 200 Dimensions in mm MMZ0603Y601C60025% 1.50 200 MMZ0603D330C 3325% 0.85 100 MMZ0603D560C 5625% 1.05 100 TEMPERATURE RANGES MMZ0603D800C 8025% 1.40 100 Operating/storage 55 to +125C MMZ0603F100C 105 0.60 200 MMZ0603F220C2225% 1.00 200 PACKAGING STYLE AND QUANTITIES MMZ0603F330C3325% 1.30 150 Packaging style Quantity Test equipment: E4991A or equivalent Taping 15000 pieces/reel Test tool: 16197 or equivalent Test temperature: 2510C RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260C Natural cooling 230C 180C 150C Preheating Soldering 60 to 120s 30 to 60s Time(s) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603S100C MMZ0603S800C MMZ0603S121C 50 450 450 45 400 400 40 350 350 35 300 300 30 250 250 25 200 200 20 Z 150 150 Z 15 R 100 Z 100 10 R R X 50 50 5 X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 ( ) ( ) Frequency MHz Frequency MHz Frequency(MHz) MMZ0603S241C MMZ0603S471C MMZ0603S601C 1000 450 1000 400 800 800 350 300 600 600 Z 250 Z R R Z 200 400 400 R 150 X X X 100 200 200 50 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 ( ) ( ) Frequency MHz Frequency(MHz) Frequency MHz All specifications are subject to change without notice. 010-01 / 20101006 / e9412 mmz0603.fm ( ) ( ) Impedance Impedance 0.30.03 0.30.03 ( ) Impedance ( ) Impedance 0.30 ( ) Impedance ( ) Impedance