(1/4) Conformity to RoHS Directive Chip Beads(SMD) For Signal Line MMZ Series MMZ2012 Type FEATURES MATERIAL CHARACTERISTICS Chip bead(impeder), MMZ series offers 4 construction materials. R material: For wide frequency applications calling for broad Size standardized for use by automatic assembly equipment. impedance characteristics. No preferred orientation. For digital signal line applications calling requiring Either flow or reflow soldering methods can be used due to good waveform integrity. Impedance values selected electroplating of the terminal electrodes. for effectiveness at 10 to 200MHz. High reliability due to an entirely monolithic structure. S material: Standard type that features impedance characteristics Closed magnetic circuit structure allows high-density installation similar to those of a typical ferrite core. while preventing crosstalk between circuits. For signal line applications in which the blocking region Low DC resistance structure of electrode prevents wasteful is near 100MHz. Impedance values selected for effec- electric power consumption. tiveness at 40 to 300MHz. The products contain no lead and also support lead-free Y material: High frequency range type intended for the 100MHz soldering. region and above. It is a product conforming to RoHS directive. For signal line applications in which the signal fre- quency is far from the cutoff frequency. Impedance val- APPLICATIONS ues selected for effectiveness at 80 to 400MHz. Personal computers, CRTs, liquid crystal display panels, printers, D material: For applications calling for low insertion loss at low fre- hard disk drives, game machines, cellular phones, etc. quencies and sharply increasing impedance at high frequencies. Designed for high impedance at high fre- PRODUCT IDENTIFICATION quencies (200 to 500MHz) for signal line applications. MMZ 2012 R 121 A T TYPICAL MATERIAL CHARACTERISTICS (1) (2) (3) (4) (5) (6) 10000 (1) Series name (2) Dimensions L W B (3) Material code 1000 (4) Nominal impedance S R 121:120 at 100MHz (5) Characteristic type 100 (6) Packaging style T:Taping D Y 10 HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference 1 110 100 1000 between the solder temperature and product temperature does ( ) Frequency MHz not exceed 150C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application are considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 004-03 / 20061022 / e9412 mmz2012.fm Impedance( )(2/4) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARACTERISTICS PATTERN Impedance DC resistance Rated current Part No. ( )25% 2+0.3, 0.1 ( )max. (mA)max. 100MHz MMZ2012R150A 15 0.05 1500 MMZ2012R300A 30 0.05 1500 MMZ2012R600A 60 0.1 1000 1.3 1 1.3 0.50.3 MMZ2012R121A 120 0.12 800 MMZ2012R301A 300 0.15 600 Weight: 10mg MMZ2012R601A 600 0.2 500 MMZ2012R102A 1000 0.3 500 Dimensions in mm MMZ2012S400A 40 0.1 1000 MMZ2012S800A 80 0.1 800 TEMPERATURE RANGES MMZ2012S121A 120 0.15 800 Operating/storage 55 to +125C MMZ2012S181A 180 0.15 600 MMZ2012S301A 300 0.2 600 PACKAGING STYLE AND QUANTITIES MMZ2012S601A 600 0.3 500 MMZ2012S102A 1000 0.35 500 Packaging style Quantity MMZ2012Y150B 15 0.05 1500 Taping 4000 pieces/reel MMZ2012Y300B 30 0.05 1500 MMZ2012Y600B 60 0.1 1000 RECOMMENDED SOLDERING CONDITION MMZ2012Y121B 120 0.12 800 REFLOW SOLDERING MMZ2012Y301B 300 0.15 600 MMZ2012Y601B 600 0.2 500 MMZ2012Y102B 1000 0.3 500 10s max. MMZ2012Y152B 1500 0.4 500 250 to 260C MMZ2012Y202B 2000 0.5 400 Natural MMZ2012D800B 80 0.3 500 cooling 230C MMZ2012D121B 120 0.3 500 MMZ2012D301B 300 0.5 400 180C Test equipment: E4991A or equivalent Test tool: 16192A or equivalent 150C Preheating Soldering 60 to 120s 30 to 60s Time(s) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R150A MMZ2012R300A MMZ2012R600A 120 120 120 100 100 100 80 80 80 60 60 60 Z 40 40 R 40 Z X 20 Z 20 20 R R X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 ( ) Frequency MHz ( ) Frequency(MHz) Frequency MHz MMZ2012R121A MMZ2012R301A MMZ2012R601A 500 500 1000 900 400 400 800 700 300 300 600 500 Z Z 200 200 400 R R 300 Z 100 100 200 X X R 100 X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 ( ) ( ) ( ) Frequency MHz Frequency MHz Frequency MHz All specifications are subject to change without notice. 004-03 / 20061022 / e9412 mmz2012.fm 0.850.2 1.250.2 ( ) ( ) Impedance Impedance 1.2 ( ) Impedance Impedance( ) ( ) ( ) Impedance Impedance