(1/4)
Conformity to RoHS Directive
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ2012 Type
FEATURES MATERIAL CHARACTERISTICS
Chip bead(impeder), MMZ series offers 4 construction materials. R material: For wide frequency applications calling for broad
Size standardized for use by automatic assembly equipment. impedance characteristics.
No preferred orientation. For digital signal line applications calling requiring
Either flow or reflow soldering methods can be used due to good waveform integrity. Impedance values selected
electroplating of the terminal electrodes. for effectiveness at 10 to 200MHz.
High reliability due to an entirely monolithic structure. S material: Standard type that features impedance characteristics
Closed magnetic circuit structure allows high-density installation similar to those of a typical ferrite core.
while preventing crosstalk between circuits. For signal line applications in which the blocking region
Low DC resistance structure of electrode prevents wasteful is near 100MHz. Impedance values selected for effec-
electric power consumption. tiveness at 40 to 300MHz.
The products contain no lead and also support lead-free Y material: High frequency range type intended for the 100MHz
soldering. region and above.
It is a product conforming to RoHS directive. For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
APPLICATIONS ues selected for effectiveness at 80 to 400MHz.
Removal of signal line noises of cellular phones, PCs, note PCs, D material: For applications calling for low insertion loss at low fre-
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
machines, digital photo frames, car navigation system, PNDs, etc.
quencies (200 to 500MHz) for signal line applications.
PRODUCT IDENTIFICATION
TYPICAL MATERIAL CHARACTERISTICS
MMZ 2012 R 121 A T
(1) (2) (3) (4) (5) (6)
2500
(1) Series name
2000
(2) Dimensions L W
Y
(3) Material code
1500
(4) Nominal impedance
1000
121:120 at 100MHz
D
S
(5) Characteristic type
R
500
(6) Packaging style
T:Taping
0
10 100 1000
Frequency(MHz)
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
Please contact our Sales office when your application are considered the following:
The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.fm
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Impedance (2/4)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARACTERISTICS
PATTERN Impedance
DC resistance Rated current
Part No. ()25%
()max. (mA)max.
20.2
[100MHz]
MMZ2012R150A 15 0.05 1500
MMZ2012R300A 30 0.05 1500
MMZ2012R600A 60 0.1 1000
0.8 1 0.8 MMZ2012R121A 120 0.12 800
0.50.3
MMZ2012R301A 300 0.15 600
Weight: 8mg MMZ2012R601A 600 0.2 500
MMZ2012R102A 1000 0.3 500
Dimensions in mm
MMZ2012S400A 40 0.1 1000
MMZ2012S800A 80 0.1 800
TEMPERATURE RANGES
MMZ2012S121A 120 0.15 800
Operating/storage 55 to +125C
MMZ2012S181A 180 0.15 600
MMZ2012S301A 300 0.2 600
PACKAGING STYLE AND QUANTITIES MMZ2012S601A 600 0.3 500
MMZ2012S102A 1000 0.35 500
Packaging style Quantity
MMZ2012Y150B 15 0.05 1500
Taping 4000 pieces/reel
MMZ2012Y300B 30 0.05 1500
MMZ2012Y600B 60 0.1 1000
RECOMMENDED SOLDERING CONDITION
MMZ2012Y121B 120 0.12 800
REFLOW SOLDERING
MMZ2012Y301B 300 0.15 600
MMZ2012Y601B 600 0.2 500
MMZ2012Y102B 1000 0.3 500
10s max.
MMZ2012Y152B 1500 0.4 500
250 to 260C
MMZ2012Y202B 2000 0.5 400
Natural
MMZ2012D800B 80 0.3 500
cooling
230C
MMZ2012D121B 120 0.3 500
MMZ2012D301B 300 0.5 400
180C
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
150C
Test temperature: 2510C
Preheating Soldering
60 to 120s 30 to 60s
Time(s)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ2012R150A MMZ2012R300A MMZ2012R600A
120 120
120
100 100
100
80
80 80
60
60
60
Z
40 40 R
40
Z
X
20 Z 20
20
R
R
X
X
0
0 0
1 10 100 1000 10000
1 10 100 1000 10000 1 10 100 1000 10000
( )
Frequency MHz ( ) Frequency(MHz)
Frequency MHz
MMZ2012R121A MMZ2012R301A MMZ2012R601A
500 500 1000
900
400 400 800
700
300 300 600
500
Z
Z
200 200 400
R R
300
Z
100 100 200
X
X
R
100
X
0 0 0
1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000
( ) ( ) ( )
Frequency MHz Frequency MHz Frequency MHz
All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.fm
( ) 0.850.2 1.250.2
Impedance() Impedance
1.2
( )
Impedance
Impedance()
( )
Impedance() Impedance