(1/4) Conformity to RoHS Directive Chip Beads(SMD) For Power Line MPZ Series MPZ1608 Type FEATURES MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By This type is the best for energy-saving in the low DC resistance. The products contain no lead and also support lead-free equalizing R components and X components that soldering. beads possess at a frequency of 5MHz, it is able to It is a product conforming to RoHS directive. suppress overshooting, undershooting and ringing of fast digital signals. APPLICATIONS R material: For wide frequency applications calling for broad Removal of power line noises of cellular phones, PCs, note PCs, impedance characteristics. TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game For digital signal line applications calling requiring machines, digital photo frames, car navigation system, PNDs, etc. good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics PRODUCT IDENTIFICATION similar to those of a typical ferrite core. MPZ 1608 S 221 A T For signal line applications in which the blocking region (1) (2) (3) (4) (5) (6) is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. (1) Series name Y material: High frequency range type intended for the 100MHz (2) Dimensions L W region and above. (3) Material code For signal line applications in which the signal (4) Nominal impedance frequency is far from the cutoff frequency. Impedance 221: 220 at 100MHz values selected for effectiveness at 80 to 400MHz. (5) Characteristic type D material: For applications calling for low insertion loss at low (6) Packaging style frequencies and sharply increasing impedance at high T: Taping frequencies. Designed for high impedance at high frequencies (300MHz to 1GHz) for signal line HANDLING AND PRECAUTIONS applications. Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference TYPICAL MATERIAL CHARACTERISTICS between the solder temperature and product temperature does 2500 not exceed 150C. D After mounting components onto the printed circuit board, do not 2000 Y apply stress through board bending or mishandling. 1500 Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. 1000 When hand soldering, apply the soldering iron to the printed cir- S R cuit board only. Temperature of the iron tip should not exceed 500 350C. Soldering time should not exceed 3 seconds. B 0 10 100 1000 Frequency(MHz) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application are considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 011-01 / 20100324 / e9413 mpz1608.fm ( ) Impedance(2/4) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARACTERISTICS 2 PATTERN Impedance DC resistance Rated current Thickness Part No. 1 ( ) 100MHz ( )max. (A)max. T(mm) 1.60.15 MPZ1608B471A 47025% 0.150 1.0 0.8 MPZ1608S300A 3010 0.010 5.0 0.6 MPZ1608S600A 6025% 0.020 3.5 0.6 MPZ1608S101A 10025% 0.030 3.0 0.6 MPZ1608S121A12025% 0.045 2.0 0.6 0.30.2 0.30.2 0.6 0.8 0.6 MPZ1608S181A 18025% 0.050 2.0 0.6 MPZ1608S221A 22025% 0.050 2.2 0.8 MPZ1608S331A 33025% 0.080 1.7 0.8 Dimensions in mm MPZ1608R391A 39025% 0.120 1.2 0.8 MPZ1608S471A 47025% 0.150 1.0 0.8 Thickness(T) Weight MPZ1608S601A 60025% 0.150 1.0 0.8 0.60.15mm 3mg MPZ1608S102A 100025% 0.300 0.8 0.8 0.80.15mm 4mg MPZ1608Y600B 6025% 0.030 2.3 0.8 MPZ1608Y101B 10025% 0.040 2.0 0.8 TEMPERATURE RANGES MPZ1608Y151B 15025% 0.050 1.8 0.8 MPZ1608Y221B 22025% 0.100 1.5 0.8 Operating/storage 55 to +125C MPZ1608D300B 3010 0.060 1.8 0.8 MPZ1608D600B 6025% 0.100 1.2 0.8 PACKAGING STYLE AND QUANTITIES MPZ1608D101B 10025% 0.150 1.0 0.8 Packaging style Quantity 1 Test equipment: E4991A or equivalent Taping 4000 pieces/reel Test tool: 16192A or equivalent Test temperature: 2510C 2 RECOMMENDED SOLDERING CONDITION Please refer to the graph of RATED CURRENT vs. TEMPERATURE CHARACTERISTICS(DERATING) about the rating current at 85C or REFLOW SOLDERING more in temperature of the product. 10s max. RATED CURRENT vs. TEMEPERATURE CHARACTERISTICS 250 to 260C (DERATING) Natural cooling 6 230C 5 180C 4 150C 3 Preheating Soldering 60 to 120s 30 to 60s 2 Time(s) 1 0 55 35 15 5 25 45 65 85 105 125 ( ) Temperature C S300A S600A S101A Y600B S221A S121A,S181A,Y101B Y151B,D300B S331A Y221B R391A,D600B B471A,S471A,S601A,D101B S102A All specifications are subject to change without notice. 011-01 / 20100324 / e9413 mpz1608.fm T 0.80.15 0.8 ( ) Rated current A