Common Mode Filters For ultra high-speed differential signal line (HDMI, DVI, DisplayPort, USB3.0, etc.) TCE series Type: TCE1210 0504 inch * TCE1210U 0504 inch TCE1608 0603 inch * Dimensions Code EIA Issue date: September 2011 All specifications are subject to change without notice. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.(1/6) Conformity to RoHS Directive Common Mode Filters For Ultra High-speed Differential Signal Line (HDMI, DVI, DisplayPort, USB3.0, etc.) TCE Series TCE1210 FEATURES PRODUCT IDENTIFICATION Common mode filter for improving EMC with an ESD protection TCE 1210 - 900 - 2P - T element (ESD suppressor) using thin-film processing and mate- (1) (2) (3) (4) (5) rial technology acquired from HDD head manufacturing. One component can be used for suppressing common mode (1) Series name noise and ESD. (2) Dimensions L W Greatly reduces the number of components and installation (3) Impedance at 100MHz area. 900: 90 By providing wide bandwidth (cutoff frequency: 3GHz min.) for (4) Number of line differential mode, this product has almost no effect for high- 2P: 2-line speed differential signals and can suppress the radiated (5) Packaging style emission. T: 180mm reel taping This product contains no lead and supports lead-free soldering. RECOMMENDED SOLDERING CONDITIONS APPLICATIONS RECOMMENDED TEMPERATURE PROFILE Suppressing noise and ESD for high-speed differential signal inter- FOR LEAD-FREE SOLDER faces such as USB 2.0, USB3.0 and HDMI for mobile devices such Peak 245C max. Natural as mobile phones, smartphones, digital cameras, and portable cooling music players, and general consumer products. 230C 180C TEMPERATURE RANGES Operating 25 to +85C 150C Storage(After mount) 25 to +85C 60 to 120s 10 to 30s PACKAGING STYLE AND QUANTITIES Packaging style Quantity ( ) Time s Taping 4000 pieces/reel REFLOW PROFILE FOR SOLDER HEAT RESISTANCE SHAPES AND DIMENSIONS/CIRCUIT DIAGRAMS Peak 260C max. Natural 4 3 1.00.07 cooling 230C 0.550.1 4 3 180C 56 150C GND 56 GND 60 to 120s 40s max. 12 1 2 0.20.1 No polarity ( ) Time s Weight: 4mg 0.30.1 Dimensions in mm RECOMMENDED PC BOARD PATTERNS 0.25 0.3 0.6 1.4 Dimensions in mm Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. All specifications are subject to change without notice. 001-02 / 20110928 / e9712 tce 0.2 1.250.07 0.570.03 0.75 +0.1 0.25 0.05 1.75 0.20.1