40 mm PICO-IMX7 The PICO-IMX7 is a System on Module (SOM) based on an NXP i.MX7 Dual core Cortex-A7 + M4 processor clocking up to 1GHz. The PICO-IMX7 operates in commercial and extended temperature ranges from -20 to 70C, providing industrial interfaces such as From RGMII, USB, I S, CAN, UART, SPI, I C, PWM, GPIO with a RGB TTL graphic interface. 35 The PICO-IMX7 is a member of the TechNexion PICO pin-to-pin product family, targeting low-power consumption embedded applications. Accelerate your time-to-market and reduce development costs with TechNexion pre-certi ed FCC / IC / CE / RCM / TELEC dual-band Wi-Fi 802.11 ac/a/b/g/n, Bluetooth. Linux, Yocto, Android runtime images and full source code available. Specications Core System Video Processor NXP i.MX7 Dual Graphic Engine Image re-sizing / rotation / overlay Processor speed up to 1GHz and CSC Pixel Processing Pipeline Architecture ARM Cortex-A7 + M4 Camera MIPI CSI (2 lanes) PMIC NXP PF3000 Memory up to 2GB DDR3L Audio Storage eMMC (4GB Default) Audio Codec On carrier board MicroSD Cardslot (optional) Audio Interface I S (2 channel) Board-to-Board Connector Edison compatibile connector PICO 70-pin Hirose connectors Operation Systems System on Module PICO System on Module Standard Support Linux Yocto Connectivity Android Network LAN RGMII Wi-Fi/Bluetooth Qualcomm QCA9377 Certi cation and Compliance 802.11 a/b/g/n/ac + BT (BR+EDR+BLE) Antenna MHF4 connector USA FCC ID: 2AKZA-QCA9377 Canada IC: 22364-QCA9377 Signaling Japan TELEC: 201-180629 European Union I/O RGB TTL SDIO EN 55032 / EN 55024 MIPI CSI CAN EN 300 328 v2.1.1 MIPI DSI UART EN 301 893 v2.1.1 Australia/New Zealand RGMII SPI RCM Bluetooth Logo PCIe I C QDID150839 (Bluetooth 4.2) Certi cation USB PWM Compliant with RoHS / REACH directives USB OTG GPIO I S For more information contact your TechNexion sales representative or email sales technexion.com www.technexion.com INNOVATORS OF TECHNOLOGY 37 mmPICO-IMX7 PICO System-on-Modules Block Diagram Certified MHF4 Wi-Fi / Bluetooth Connector 2 SDIO UART MicroSD OR Connector 1 Additional Signals NXP eMMC i.MX7 Dual Edison Signals Edison DDR3L Connector NXP PMIC Order Information : Environmental and Mechanical PICO-IMX7x-xx-Rxx-xxx-xxxx-xx-xxxx Dimensions 37 x 40 mm / 1 x 1 inch Code Description Form Factor PICO Compute Module Processor IMX7D NXP i.MX7Dual Weight 8 grams Processor Speed 08 800MHz Temperature Commercial: 0 to +60C 10 1.0GHz Extended: -20 to +70C Memory R05 512MB DDR3L Relative Humidity 10 to 90 % R10 1GB DDR3L MTBF >100 000 Hours MSD MicroSD Cardslot Storage Shock 50G/25ms E16 eMMC 16GB EXX eMMC other capacity Vibration 20G/0-600Hz Wi-Fi / Bluetooth - - Qualcomm QCA9377 802.11a/b/g/n/ac 9377 (2.4 + 5GHz) + Bluetooth Power Specications Temperature Range - Commercial Temperature range Power Input 4.25-5.25 VDC (0 to +60C)(Default) Power Consumption Depending on Con guration Extended Temperature range TE (-20 to +70C) Custom ID XXXX Custom Part number ID for customized software loader and special component (BOM) Dimensions (units in mm) 34.27 6.33 37 2.0 22.07 38.53 40 17.7 For more information contact your TechNexion sales representative or email sales technexion.com www.technexion.com INNOVATORS OF TECHNOLOGY 2020-09-09 All speci cations are subject to change without notice. TechNexion All rights reserved worldwide.