PICOIMX8MMQ18R40E16 Technexion

40 mm PICO-IMX8M The PICO-IMX8M is a System on Module (SOM) based on an NXP i.MX8M Quad core Cortex-A53 + M4 processor clocking up to 1.5GHz. The PICO-IMX8M operates in commercial and industrial temperature ranges from -40 to 85C. The on-board Vivante From GC7000Lite GPU OpenGL ES 3.1, OpenGL 3.0, Vulkan, Open CL 1.2 yield superb 4K HDR content on HDMI and MIPI-DSI 57 display complementing 2 MIPI-CSI2 camera interfaces. The PICO-IMX8M is a member of the TechNexion PICO pin-to-pin product family, providing scalable embedded solutions targeting pixel rich and audio applications. Accelerate your time-to-market and reduce development costs with TechNexion pre-certi ed FCC / IC / CE / RCM / TELEC dual-band Wi-Fi 802.11 ac/a/b/g/n, Bluetooth. Linux, Yocto, Android runtime images and full source code available. Specications Core System Video Processor NXP i.MX8M Quad Graphic Engine Vivante GC7000Lite Processor Speed up to 1.5GHz Video Decode 4K UltraHD HDR 4Kp60 Architecture ARM Cortex-A53 + M4 H.265 VP9 PMIC RoHM BD71837 Camera MIPI CSI (4 lanes) Memory up to 4GB LPDDR4 Storage eMMC Audio Board-to-Board Connector Edison compatibile connector Audio Codec On carrier board PICO 70-pin Hirose connectors Audio Interface I S (2 channel) System on Module PICO SOM Operation Systems Connectivity Standard Support Linux Network LAN RGMII Yocto Wi-Fi/Bluetooth Qualcomm QCA9377 Android 802.11 a/b/g/n/ac + BT (BR+EDR+BLE) Antenna MHF4 connector Certi cation and Compliance Signaling USA FCC ID: 2AKZA-QCA9377 Canada IC: 22364-QCA9377 I/O HDMI I S Japan TELEC: 201-180629 MIPI CSI UART European Union EN 55032 / EN 55024 MIPI DSI SPI EN 300 328 v2.1.1 RGMII I C EN 301 893 v2.1.1 PCIe PWM Australia/New Zealand RCM USB GPIO Bluetooth Logo QDID150839 (Bluetooth 4.2) USB OTG Certi cation Compliant with RoHS / REACH directives For more information contact your TechNexion sales representative or email sales technexion.com www.technexion.com INNOVATORS OF TECHNOLOGY 37 mmPICO-IMX8M PICO System-on-Modules Block Diagram Certified MHF4 Wi-Fi / Bluetooth Connector 2 SDIO UART Connector 1 Additional Signals NXP eMMC i.MX8M Quad Edison Signals Edison DDR4 Connector BD71837 PMIC Order Information : Environmental and Mechanical PICO-IMX8Mx-xx-Rxx-Exx-xxxx-xx-xxxx Dimensions 37 x 40 mm / 1 x 1 inch Code Description Form Factor PICO Compute Module Processor IMX8MQ NXP i.MX8MQuad Weight 8 grams Processor Speed 13 1.3GHz Temperature Commercial: 0 to +60C 15 1.5GHz Industrial: -35 to +85C Memory R10 1GB LPDDR4 Relative Humidity 10 to 90 % R20 2GB LPDDR4 MTBF >100 000 Hours R40 4GB LPDDR4 Shock 50G/25ms Storage E16 eMMC 16GB EXX eMMC other capacity Vibration 20G/0-600Hz Wi-Fi / Bluetooth - - 9377 Qualcomm QCA9377 802.11a/b/g/n/ac Power Specications (2.4 + 5GHz) + Bluetooth Temperature Range - Commercial Temperature range Power Input 4.25-5.25 VDC (0 to +60C) (Default) Power Consumption Depending on Con guration Industrial Temperature range TI (-40 to +85C) Custom ID XXXX Custom Part number ID for customized Software loader and special component (BOM) Dimensions (units in mm) 28.7 37 20.6 2.0 37.1 40 11.4 For more information contact your TechNexion sales representative or email sales technexion.com www.technexion.com INNOVATORS OF TECHNOLOGY 2020-09-09 All speci cations are subject to change without notice. TechNexion All rights reserved worldwide.