FDT SERIES ELEMENTS WITH LEAD ATTACHMENT SPECIFICATIONS Piezo Film Technology Flexible Leads High Strain Output Film Thickness Options Lamination Options Solderable Connection Pins The F in FDT Series stands for Flexible Leads. These are rectangle elements of Piezo film with silver ink screen printed electrodes. Rather than making the lead attachment near the sensor, the Piezo polymer FEATURES tail extends from the active sensor area as flex circuit Thin piezo film sensor material with offset traces. This gives a very flat, flexible Flexible leads give flat profile to the sensor lead with a connector at the end. Dynamic strain sensing with a high output Typical interface to a 1 or 10 M input The FDT elements are available in a variety of impedance different sizes and thicknesses. They are available without Output Voltage (dependent on force applied) a laminate (FDT), with a laminated (0.005 mylar) on one 10 mV to 100V side (FLDT) or with tape release layer adhesive (FDT with adh) in the sensor area. APPLICATIONS Sensing Direct Contact Force Recording Time of an Event Counting Number of Impact Events Measuring Impact Related Events Sensing Vibration using Cantilevered Beam Wakeup Switch Motion Detection SENSOR SOLUTIONS /// FDT Series Rev 1 07/2017 Page 1 FDT SERIES ELEMENTS WITH LEAD ATTACHMENT DIMENSIONS and PART NUMBERS DIMENSION in INCHES (mm) Model Number Part Number Film A B C D t Cap thickness Film Electrode Film Electrode (m) (nF) FDT1-028K 1-1002785-1 28 m .620 (16) .485 (12) 9.25 (235) 1.16 (30) 55 1.37 FDT1-052K 2-1002785-1 52 m .620 (16) .485 (12) 9.25 (235) 1.16 (30) 85 .740 FLDT1-028K 1-1002786-1 28 m .620 (16) .485 (12) 9.25 (235) 1.16 (30) 205 1.37 FLDT1-052K 2-1002786-1 52 m .620 (16) .485 (12) 9.25 (235) 1.16 (30) 230 .740 FDT1-028K 1001777 28 m .650 (17) .485 (12) 5.51 (140) 1.18 (30) 125 1.37 w/adh-F The connector pins on the FDT sensors can be directly soldered to a PCB with a reasonable level of care. This component cannot withstand high temperatures (>80C) and therefore soldering of the pins to a PCB must be done quickly. A heat sink clamped to the interface area between the film and the crimps will take the heat away from the film. Pre-tin the pins and then quickly solder them to the board. Do not allow the soldering iron to touch the film and do not use a dwell time of more than 5 seconds on the pins. Low temperature solder can also be used. NORTH AMERICA EUROPE ASIA Measurement Specialties, Inc., MEAS Deutschland GmbH Measurement Specialties (China), Ltd., a TE Connectivity Company a TE Connectivity Company a TE Connectivity Company Tel: +1-800-522-6752 Tel: +49-800-440-5100 Tel: +86 0400-820-6015 Email: customercare.dtmd te.com Email: customercare.dtmd te.com Email: customercare.chdu te.com TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivitys obligations shall only be as set forth in TE Connectivitys Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. 2015 TE Connectivity Ltd. family of companies All Rights Reserved. SENSOR SOLUTIONS /// FDT Series Rev 1 07/2017 Page 2