Application Specification MULTIGIG RT 2, RT 2-R, RT 2-S, and RT 3 Signal Connectors 114-163004 12 MAR 2019 Rev B Abstract This specification covers the requirements for application of MULTIGIG RT 2, RT 2-R, RT 2-S, and RT 3 connectors used to interconnect printed circuit (pc) boards. RT 2, RT 2-R, and RT 2-S connectors are compliant to the VITA 46 standard for VPX architecture, and RT 3 is defined in the VITA 46.30 standard. RT 3 is interface compatible with all RT 2 variants, but utilizes different board footprints with smaller compliant pins and plated thru holes to achieve 25+ Gb/s data rates. The connectors consist of end-to-end stackable modules, available in vertical receptacles (backplane application) and right-angle plugs (daughtercard application). Half and full-size connector modules are used within slots of a backplane/plug- in card application. The VITA 46 standard defines connector requirements and OpenVPX standard slot configurations are defined in VITA 65.0 and 65.1. Table of Contents 1. INTRODUCTION .............................................................................................................. 4 1.1. Features .............................................................................................................................. 6 Modules ................................................................................................................................................. 6 Guide Assemblies .................................................................................................................................. 6 1.2. Density Levels .................................................................................................................... 6 2. REFERENCE MATERIAL ................................................................................................ 6 2.1. Revision summary ............................................................................................................. 6 2.2. Drawings ............................................................................................................................ 7 2.3. Specifications .................................................................................................................... 7 3. Requirements ................................................................................................................. 7 3.1. Limitations ......................................................................................................................... 7 3.2. Material ............................................................................................................................... 7 3.3. Storage ............................................................................................................................... 8 Ultraviolet Light ...................................................................................................................................... 8 Shelf Life ................................................................................................................................................ 8 Chemical Exposure ............................................................................................................................... 8 Storage Temperature ............................................................................................................................ 8 3.4. Special Assembly Considerations .................................................................................... 8 System Design ....................................................................................................................................... 8 Soldering Exposure ............................................................................................................................... 8 3.5. Module Configuration ...................................................................................................... 10 3.6. PC Board .......................................................................................................................... 14 Material and Thickness ........................................................................................................................ 14 Tolerance ............................................................................................................................................. 14 Hole Dimensions.................................................................................................................................. 14 Layout .................................................................................................................................................. 15 Backdrill dimensions ............................................................................................................................ 16 3.7. Module and Guide Assembly Placement ....................................................................... 16 Spacing ................................................................................................................................................ 16 Polarization .......................................................................................................................................... 16 2019 TE Connectivity Ltd. family of companies. PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change. 1 of 27 All Rights Reserved. For latest revision and Regional Customer Service, *Trademark visit our website at www.te.com. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners. 114-163004 Registration .......................................................................................................................................... 16 Additional Daughtercard Retention...................................................................................................... 18 Seating ................................................................................................................................................. 19 Mounting Hardware ............................................................................................................................. 20 3.8. Checking Installed Module .............................................................................................. 21 3.9. Mating and Unmating ...................................................................................................... 21 Keying .................................................................................................................................................. 21 Misalignment ........................................................................................................................................ 22 Sequencing .......................................................................................................................................... 22 Wipe Length ......................................................................................................................................... 23 Mating Dimension ................................................................................................................................ 23 Mating and Unmating Force ................................................................................................................ 24 4. Qualification .................................................................................................................. 24 5. Tooling .......................................................................................................................... 24 5.1. Application Tooling ......................................................................................................... 24 Manual Arbor Frame ............................................................................................................................ 24 Automatic Press................................................................................................................................... 24 5.2. Push Bar (Flat Rock) ........................................................................................................ 24 5.3. PC Board Support ............................................................................................................ 24 5.4. Removal ............................................................................................................................ 25 Guide Hardware................................................................................................................................... 25 Backplane Connector Module ............................................................................................................. 25 Daughtercard Connector Module ........................................................................................................ 25 5.5. Repair ............................................................................................................................... 26 6. Visual Aid ...................................................................................................................... 26 2 of 27 Rev B