TE Connectivity My Cart My Part Lists Sign In/Register English Products Industries Resources About TE My Account Innovation Support Center Home > Products > Socket/Card Products > Product Feature Selector > Product Details Share Print Email 2013310-1 Product Details Quick Links Memory Sockets Always EU RoHS/ELV Compliant Statement of Compliance ( ) Check Pricing & Availability Search for Tooling Product Feature Selector Product Highlights: Contact Us About This Product Socket Type = Memory Card Socket Style = SO DIMM Gold Flash Contact Plating, Mating Area, Material 204 Positions DRAM Type = Double Data Rate (DDR) III 2013310-1 View all Features TE Internal Number: 2013310-1 Active A dd to My Part List Request Sample Find Similar Products Buy Product View 3D PDF Documentation & Additional Information Product Drawings: Additional Information: DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT S... (PDF, English) Product Line Information Catalog Pages/Data Sheets: Related Products: 6-1773457-3 DDR3 DIMM SOCKETS (PDF, Chinese (Simplified)) Tooling Product Specifications: None Available Application Specifications: None Available Instruction Sheets: None Available CAD Files: (CAD Format & Compression Information) 2D Drawing (DXF, Version C) 3D Model (IGES, Version C) 3D Model (STEP, Version C) List all Documents (Please use the Product Drawing for all design activity) Product Features Product Type Features: Configuration Features: Socket Style = SO DIMM Number of Positions = 204 DRAM Type = Double Data Rate (DDR) III Stack Height (mm in ) = 9.20 0.362 PCB Mount Style = Surface Mount Number of Rows = Dual Module Orientation = Right Angle Center Key (mm in ) = Offset Left Number of Keys = 1 Electrical Characteristics: DRAM Voltage = 1.5 V Industry Standards: RoHS/ELV Compliance = RoHS compliant, ELV compliant Lead Free Solder Processes = Reflow solder capable to 245C, Termination Features: Reflow solder capable to 260C Insertion Style = Cam-In RoHS/ELV Compliance History = Always was RoHS compliant Body Features: Socket Type = Memory Card Identification Marking: Keying = Standard Row-to-Row Spacing (mm in ) = 8.20 0.322 Ejector Type = Locking Operation/Application: Ejector Location = Both Ends Application Type = DDR 3 SO-DIMM Latch Material = Stainless Steel Latch Plating = Tin Packaging Features: Boss = With Packaging Method = Semi-Hard Tray Assembly Contact Features: Other: Contact Plating, Mating Area, Material = Gold Flash Brand = TE Connectivity Contact Base Material = Copper Alloy Comment = With floating page.Comment = With floating page. Housing Features: Centerline (mm in ) = 0.60 0.024 Housing Material = High Temperature Thermoplastic Housing Color = Black Corporate Information Quick Links Customer Support Keep Me Informed Receive TE News, Events & About TE Check Distributor Inventory Email or Chat With Us Technology Updates Investors Cross Reference Products Find a Phone Number Enter your email address News Room Find Documents & Drawings Search Knowledge Base Supplier Portal Product Compliance Support Center Manage Your Account Careers Site Map Terms & Conditions Privacy Policy 2013 Tyco Electronics C orporation, a TE C onnectivity Ltd. company. A ll Rights Reserved P rovide Website Feedback