MEZALOK CONNECTORS HIGH-RELIABILITY MEZZANINE CONNECTORS Rugged Surface-Mount Mezzanine Connectors for Embedded Computing Support Data Rates to 10+ Gb/s AEROSPACE, DEFENSE & MARINE /// MEZALOK CONNECTORS MEZALOK CONNECTORS HIgh-Reliability Mezzanine Connectors Rugged Mezzanine Connectors Mezalok mezzanine connectors are designed for stacking or mezzanine applications for rugged embedded computing. The connectors incorporate a quad-redundant Mini-Box contact system for a separable interface, and are available in 60, 114, and 320 positions with stack height options of 10, 12, 15, and 18 mm. VITA 61 XMC Compliant Mezalok connectors are shock and vibration resistant per VITA 47 and 72 HALT test requirements. The 114-position connector is compliant HIGH RELIABILITY to VITA 61. Mini-Box contact system provides four points of contact Rugged Choice for High-Speed T hermoplastic housing provides Mezzanine Applications excellent thermal stability 500 mating cycles Featuring a wide operating temperature range, excellent thermal stability, and data rates to 10+ Gb/s, these rugged and highly versatile VERSATILE connectors are ideal for high-speed embedded computing applications. Available in 60, 114, and Installation of Mezalok connectors is easily accomplished using standard 320 positions BGA surface mount processes. Stack height options include 10, 12, 15, and 18 mm Specifications Pins can be alloca ted for single ended or differential signal ENVIRONMENTAL/MECHANICAL CAPABLE Durability: 500 mating cycles Supports data rates to 10+ Gb/s Mating Force: 0.30 lbs. per contact Low outgassing housing Temperature Range: -65C to +125C Shock/Vibration Resistance: VITA 47/72 HALT -65C t o +125C operating temperature range ELECTRICAL APPLICATIONS Data Rates: 10+ Gb/s VPX embedded computing Pins: Single-ended or differential signal XMC card applications MATERIALS Military Pin Assembly: LCP housings, white A erospace Socket Assembly: LCP housings, white Contacts: High-performance copper alloy, 30 or 50 gold in mating interface (Tin/lead and SAC405 solder balls are available) STANDARDS AND SPECIFICATIONS Application Specification: 114-13279 Product Specification: 108-2411 Qualification Test Report: 501-736 TE Components . TE Technology . TE Know-how . AMP Agastat CII Hartman Kilovac Microdot Nanonics Polamco Raychem Rochester DEUTSCH SEACON Phoenix L.L. Rowe Phoenix Optix AFP SEACON Get your product to market faster with a smarter, better solution. AEROSPACE, DEFENSE & MARINE /// MEZALOK CONNECTORS PAGE 2