zSFP+ 28 Gbps Pluggable I/O Interconnect The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28 Gbps with possible expansion to 40 Gbps. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is hot-swappable with existing SFP+ connectors for fast system upgrades of 28-40 Gbps. Alternatively, users can design-in the zSFP+ connector for 10-16 Gbps data rates, establishing a progressive path to higher speedsan upgradeability that can result in long- term cost savings as this would eliminate the need to fully redesign for higher performance. The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire product family is offered as a dual source option with Molex Incorporated. te.com/products/zsfp+TE Connectivity zSFP+ 28 Gbps Pluggable I/O Interconnect FEATURES Data rates: 28 Gbps (with possible expansion to 40 Gbps), 10 Gbps Ethernet and 16 Gbps Fibre Channel Surface-mount connector design for single high 1xN cages Press-fit 1xN cages and stacked assemblies (connector and cage) for one-step, easy PCB placement Coupled, narrow-edged, blanked- and formed-contact beam geom- etry and insert molding for superior signal integrity, mechanical and electrical performance Backwards-compatibility: Shares same mating interface and cage dimensions with the SFP+ connector (connector/single high cages are also PCB footprint-compatible) Elastomeric gasket or spring finger options for EMI containment Single high cages (1xN) for design flexibility accommodates belly- to-belly applications for increased density and PCB space savings available in 1x1, 1x2, 1x4 or 1x6 port configurations Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12 port Heat sinks, LEDs and plating choices offered APPLICATIONS Telecommunications: Cellular infrastructure, central office uplink equipment, optical transport equipment, switches/ routers, access equipment (CMTS, PON, DSL, etc) Data Center: Data center switches and routers, servers, storage Medical: Medical diagnostic equipment Networking: Network interface, switches, routers Test and Measurement Equiptment 20-Pin Surface-Mount Connector Electrical Voltage (max.): 120V AC Current (max.): 0.5A Dielectric Withstanding Voltage: 300V AC between contacts Mechanical Mating Force: 25N Unmating Force: 11.5N Durability (min.): 250 cycles Physical High-temperature thermoplastic housing (glass-filled, UL 94V-0 black) High-performance copper alloy contacts Plating: - Nickel underplating Tin plating on solder tail area Gold plating on mating area - Plating options: 15 and 30 Gold or Palladium Nickel Operating Temperature: -40 to +85C te.com/products/zsfp+