108-1272 Product 11Mar11 Rev A Specification Micro-Strip Board to Board Connector 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for TE Connectivity (TE) Micro- Strip board to board right angle and vertical connector family. These assemblies accommodate a variety of printed circuit board thicknesses. Plug assemblies are loaded with .015 inch square male Micro-Strip contacts which mate with receptacle assemblies loaded with female Micro-Strip contacts. 1.2. Qualification W hen tests are performed on subject product line, procedures specified in 109 Series Test Specifications shall be used. All inspections shall be performed using applicable inspection plan and product drawing. 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. Unless otherwise specified, latest edition of the document applies. In the event of conflict between requirements of this specification and product drawing, product drawing shall take precedence. In the event of conflict between requirements of this specification and referenced documents, this specification shall take precedence. 2.1. TE Documents 109-1: General Requirements for Test Specifications 109 Series: Test Specifications as indicated in Figure 1 114-11005: Application Specification 501-235: Test Report 3. REQUIREMENTS 3.1. Design and Construction Product shall be of design, construction and physical dimensions specified on applicable product drawing. 3.2. Materials Contact: Phosphor bronze or beryllium copper, selective gold over nickel plating Housing: High temperature thermoplastic, liquid crystal polymer 3.3. Ratings Voltage: 30 volts alternating current Current: See Figure 2 for applicable current carrying capability Temperature: -65 to 125EC 2011 Tyco Electronics Corporation, Indicates change For latest revision, visit our website at www.te.com/documents. 1 of 8 a TE Connectivity Ltd. Company *Trademark For Regional Customer Service, visit our website at www.te.com All Rights Reserved TE logo is a trademark. Other products, logos, and company names might be trademarks of their respective owners. LOC B108-1272 3.4. Performance and Test Description Product is designed to meet electrical, mechanical and environmental performance requirements specified in Figure 1. All tests are performed at ambient environmental conditions per Test Specification 109-1 unless otherwise specified. 3.5. Test Requirements and Procedures Summary Test Description Requirement Procedure Examination of product. Meets requirements of product Visual, dimensional and functional drawing and Application per applicable quality inspection Specification 114-11005. plan. ELECTRICAL Termination resistance, dry circuit. Vertical signal: Subject mated contacts assembled 20 milliohms maximum initial. in housing to 50 mv open circuit at R 7 milliohms maximum. 100 ma maximum. See Figure 4. Ground bus: TE Spec 109-6-1. 10 milliohms maximum initial. R 4 milliohms maximum. Right angle signal: 25 milliohms maximum initial. R 7 milliohms maximum. Extended M-bus signal: 40 milliohms maximum initial. R 7 milliohms maximum. Dielectric withstanding voltage. 500 vac at sea level. Test between adjacent signal No breakdown or flashover. contacts and between signal contacts and ground contacts of mated connector assemblies. TE Spec 109-29-1. Insulation resistance. 5000 megohms minimum. Test between adjacent signal contacts and between signal contacts and ground contacts of mated connector assemblies. TE Spec 109-28-1. Temperature rise vs current. 30EC maximum temperature rise at Measure temperature rise vs specified current. current. See Figures 2 and 4. TE Spec 109-45-1. MECHANICAL Vibration, random. No discontinuities greater than 1 Subject vertical and right angle microsecond. connectors to 11.6 G s rms. See Note. See Figure 5. TE Spec 109-21-5, Test Level D, Duration 15 minutes. Subject extended M-bus connectors to 10-500 Hz. See Figure 5. TE Spec 109-21-7, Test level F, Duration 15 minutes. Physical shock. No discontinuities greater than 1 Subject mated connectors to 50 G s microsecond. half-sine shock pulses of 11 See Note. milliseconds duration. 3 shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. See Figure 5. TE Spec 109-26-1. Figure 1 (continued) Rev A 2 of 8