X-On Electronics has gained recognition as a prominent supplier of 618-6 Wire Labels & Markers across the USA, India, Europe, Australia, and various other global locations. 618-6 Wire Labels & Markers are a product manufactured by TE Connectivity. We provide cost-effective solutions for Wire Labels & Markers, ensuring timely deliveries around the world.

618-6 TE Connectivity

Name: 618-6
Brand: TE Connectivity
SKU: 6186_TE Connectivity
Availability: OutOfStock
Rating: 5 (11 reviews)

618-6 electronic component of TE Connectivity

Images are for reference only
See Product Specifications

Part No.	618-6
Manufacturer:	TE Connectivity
Category:	Wire Labels & Markers
Description:	CPU - Central Processing Units Core i3-4340TE Dual CR 2.6GHz FCLGA1150
Datasheet:
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

18: USD 1.9051 ea
Line Total: USD 34.29

Availability - 0

MOQ: 18 Multiples: 1
Pack Size: 1

618-6 More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Fri. 29 Nov to Thu. 05 Dec MOQ : 15 Multiples : 1	15 : USD 1.9963

0 Ship by Mon. 23 Dec to Fri. 10 Jan MOQ : 18 Multiples : 1	18 : USD 1.9051 250 : USD 1.8257 800 : USD 1.7596 2000 : USD 1.6934 7000 : USD 1.6273

Specifications

Manufacturer TE Connectivity TE Connectivity
Product Category Wire Labels & Markers Wire Labels & Markers
RoHS - XON Y Y
Product Desktop Processors Desktop Processors
Series I3 - 4340Te I3 - 4340Te
Family Intel Core I3 Intel Core I3
Memory Size 32 gb 32 gb
Memory Type Ddr3l - 1333,1600 Ddr3l - 1333,1600
Package / Case FCLGA - 1150 FCLGA - 1150
Package / Case Size 37.5 mm x 37.5 mm 37.5 mm x 37.5 mm
Brand Te Connectivity Te Connectivity
Mounting Style Smd/Smt Smd/Smt
Cache 4 Mb 4 Mb
Code Name Haswell Haswell
Core Intel Core I3 Intel Core I3
Cpu Configuration - Max 1 1
Data Bus Width 64 bit 64 bit
Ecc Memory Supported Supported Supported
Embedded Options Embedded Embedded
Intel Hyper-Threading Technology With Ht Technology With Ht Technology
Intel Virtualization Technology - Vt With Vt With Vt
Lithography - Process Technology 22 Nm 22 Nm
Maximum Clock Frequency 2.6 GHz 2.6 GHz
Maximum Operating Temperature + 72 C + 72 C
Number Of Cores 2 2
Number Of Displays Supported 3 3
Number Of Memory Channels 2 2
Number Of Pci Express Lanes 16 16
Number Of Threads 4 4
Pcie Configurations 1 X16/2 X8/1 X8 + 2 X4 1 X16/2 X8/1 X8 + 2 X4
Pcie Revision 3.0 3.0
Processor Series I3 - 4340Te I3 - 4340Te
System Bus Speed 5 Gt/S 5 Gt/S
System Bus Type Dmi2 Dmi2
Tdp - Max 35 W 35 W
Tradename Core I3 Core I3

We are delighted to provide the 618-6 from our Wire Labels & Markers category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 618-6 and other electronic components in the Wire Labels & Markers category and beyond.

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HS Compliance

Tariff Desc

3926.90.90 Other articles of plastics and articles of other materials ---Other

4811.41.10 Goods, as follows:
(a) in rolls or strips of a width not exceeding 15 cm;
(b) in rectangular (including square) sheets in which no side exceeds 36 cm, in the unfolded state;
(c) in rectangular sheets with one side exceeding 36 cm and the other side not exceeding 15 cm, in the unfolded state:

4821.90.00 TC 1206403 LABELS, thermal transfer, self adhesive, having ALL of the
following:
(a) paper layer;
(b) metal carrier layer;
(c) adhesive layer;
(d) heat resistance to 350 degrees C

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