CUSTOMER DRAWING
Product Name D X
B-801-06 0.68 0.8
B-801-08 0.88 1
MATERIALS
1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride.
2. SOLDER PREFORM WITH FLUX:
SOLDER: TYPE Sn62 Pb36 Ag2 per ANSI-J-STD-006.
FLUX: TYPE ROL0 per ANSI-J-STD-004.
3. PIN: Phosphor bronze coated with Sn60 Pb40 solder alloy.
APPLICATION
1. These controlled soldering devices are designed for termination of a tin or silver plated stranded AWG26, AWG24 and AWG22
conductor having an insulation rated for at least +125 C on a PC board with X diameter hole. If AWG20 wire is used, pre-tinning
is recommended.
2. Temperature range: -55 C to +150 C. For application tooling, contact your local TE Connectivity technical service.
For best results, prepare the wire as shown:
TITLE:
Raychem
PINPAK* DEVICE FOR PCB
THERMOFIT
DEVICES TERMINATION
DOCUMENT NO.:
Unless otherwise specified dimensions are in millimeters.
[Inches dimensions are shown in brackets]
B-801-0X
TOLERANCES: ANGLES: N/A TE Connectivity reserves the right to
0.00 N/A amend this drawing at any time.
REV: DATE:
0.0 N/A ROUGHNESS IN Users should evaluate the suitability
3 09-Mar-2020
0 N/A MICRON of the product for their application.
DRAWN BY: DATE: ECO: SCALE: SIZE: SHEET:
M. FORONDA 22-Mar-1999 NTS A 1 of 1
ECO-20-003687
09-Mar-2020 Tyco Electronics Corporation. All rights reserved.
If this document is printed it becomes uncontrolled. Check for the latest revision.
*TE Connectivity, TE connectivity (logo), Raychem, THERMOFIT, SolderSleeve are trademarks X-ON Electronics
Largest Supplier of Electrical and Electronic Components
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