GA10K3CG582 TE Connectivity

te.com GOLD CHIP THERMISTOR GA10K3CG582 Description TE Connectivity offers a comprehensive range of Gold terminated leadless NTC chip thermistors for todays hybrid microelectronics needs. With metallization on top and bottom surfaces, attachment to hybrid, IC or PC circuits is accomplished using industry standard die attach and wire bonding techniques. Chips may be soldered or bonded with conductive epoxy to board termination points where space is at a premium. Typical square-chip sizes range from 0.35 mm to 1.2 mm Features depending on the preferred ceramic system and nominal ohmic Gold electrodes suitable for wire bonding resistance. MTTF reliability information is provided for the complete Mount directly to substrate for fast time- range of gold chip products for customer selection and design-in. Gold response Temperature range -40C to +125C terminated NTC thermistors are supplied in waffle packs for protection High stability performance with additional and ease of customer handling. aging steps Delivers advanced electro-ceramic Specifications materials with fine grained microstructure Packed in waffle trays 10K Ohms Resistance +25C 2% Resistance Tolerance +25C Applications Rapid Time Response WDM (Wavelength Division Multiplexing) for advanced frequency control in Beta 25/85 = 3976 1.0 % communications systems and wireless applications Thermopile sensors for thermal radiation recognition and infrared sensing Thermal protection of sensitive circuits Hybrid circuit temperature compensation Localized temperature sensing Laser diode modules CLICK HERE CONNECT WITH A SPECIALIST TE CONNECTIVITY SENSORS /// GOLD CHIP THERMISTOR 06/2021 Page 1 GOLD CHIP THERMISTOR GA10K3CG582 Performance specifications Parameters Units Value Resistance +25C Ohms 10,000 Resistance Tolerance +25C % 2 Beta Value 25/85 K 3976 Tolerance on Beta Value 25/85 % 1 Operating Temperature C -40 to +125C Thermal Time Constant in Air * Seconds < 2 Dissipation Constant * mW/C 0.25 Maximum Power Dissipation * mW 25 Note: Time Response and DC measurements performed with Alloy 180 Lead wires 0.2mm (0.008) soldered to chip Mechanical details Dimensions Thickness Width Length 0.20mm Min - 0.30mm Max 0.38mm Min - 0.48mm Max 0.38mm Min - 0.48mm Max Notes 1 Gold Metallization - Top and Bottom electrodes 2 TE Electro Ceramic Material: BT3Lo-D TE CONNECTIVITY SENSORS /// GOLD CHIP THERMISTOR 06/2021 Page 2