TLM2BDR030FTE TE Connectivity

SMD Current Sense Metal Chip Resistor Type TLM Series Key Features Low resistance resistor for current detection Small size to power ratio Metal foil construction ensures high reliability and performance with very low and stable TCR Designed for current sense circuits in power electronic systems TE Connectivity is pleased to introduce this low ohmic metal chip resistor designed for current sense circuits in power electronic systems. Supplied as Terminal finish matte Sn over Ni standard on tape and reel for automatic insertion processes. Characteristics Electrical Resistance Range (m) Power Rating @ Operating Temp. Type TCR (PPM/C) 70C Range 1% 2% 5% 10 - 19 100 TLM 1J 0.125W 50 20 - 100 100 10 - 19 100 TLM 2A 0.25W 50 20 - 100 100 10 19 100 TLM 2B 0.5W -55~+55C 50 20 - 100 100 10 19 100 TLM 2H 0.75W 50 20 - 100 100 10 19 100 TLM 3A 1W 50 20 - 100 100 Operating Voltage=(P*R) ; Overload Voltage=2.5*(P*R) ; Operating Current=(P/R) Dimensions in Dimensions Shown for 1773269-1 CIS WR 01/2015 For Email, phone or live chat, millimetres unless reference purposes only. go to: www.te.com/help otherwise specified Specifications subject to change SMD Current Sense Metal Chip Resistor Power derating curve For resistors operated in ambient temperatures above 70C, power rating must be derated in accordance with this curve. Environmental Characteristics Item Requirement Test Method Temperature Coefficient of As Spec. -55C~+125C, 25C is the reference Resistance (TCR) temperature Short Term Overload (0.5%+0.05) 5 X Rated Power for 5 seconds Insulation Resistance 10G Max. overload voltage for 1 minute Endurance (1.0%+0.05) 702C, Max. working voltage for 1000 hrs with 1.5 hrs ON and 0.5 hrs OFF Damp Heat with Load (1.0%+0.05) 402C, 90~95% R.H. Max. working voltage for 1000 hrs with 1.5 hrs ON and 0.5 hrs OFF Dry Heat (0.5%+0.05) at +155C for 1000 hrs Bending Strength As Spec. Bending once for 5 seconds 2010, 2512 sizes: 2mm Other sizes: 3mm Solderability 95% min. coverage 2455C for 3 seconds Resistance to Soldering Heat (0.5%+0.05) 2605C for 10 seconds Voltage Proof No breakdown or flashover 1.42 times RCWV (RMS) for 1 minute Leaching Individual leaching area 2605C for 30 seconds 5% Total leaching area 10% Rapid Change of (0.5%+0.05) -55C to +155C, 5 cycles Temperature Reference Standards: IEC 60115-1, 60068-2-58; JIS-C 5201-1 Storage Temperature: 253C; Humidity < 80%RH Dimensions in Dimensions Shown for 1773269-1 CIS WR 01/2015 For Email, phone or live chat, millimetres unless reference purposes only. go to: www.te.com/help otherwise specified Specifications subject to change