X-On Electronics has gained recognition as a prominent supplier of G4A01128C across the USA, India, Europe, Australia, and various other global locations. G4A01128C are a product manufactured by Thermodisc. We provide cost-effective solutions for G4A01128C, ensuring timely deliveries around the world.

G4A01128C Thermodisc

Name: G4A01128C
Brand: Thermodisc
SKU: G4A01128C_Thermodisc
Availability: OutOfStock
Rating: 5 (11 reviews)

G4A01128C electronic component of Thermodisc

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See Product Specifications

Part No.	G4A01128C
Manufacturer:	Thermodisc
Category:	Unclassified
Description:	FUSE, THERMAL, 128°C, 10A, 250VAC
Datasheet:	G4A01128C Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 1.2324 ea
Line Total: USD 1.23

Availability - 0

MOQ: 1 Multiples: 1
Pack Size: 1

G4A01128C More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Tue. 26 Nov to Mon. 02 Dec MOQ : 1 Multiples : 1	1 : USD 1.2324 10 : USD 1.0061 25 : USD 0.8771 50 : USD 0.8058 100 : USD 0.7593

Specifications

Manufacturer Thermodisc Thermodisc
Product Category Unclassified Unclassified
Brand Thermodisc Thermodisc
Product Range MICROTEMP Series MICROTEMP Series
Fuse Current 10 A 10 A
Voltage Rating Vac 250 V 250 V
Functioning Temperature 128 C 128 C
Fuse Terminals Axial Leaded Axial Leaded
Holding Temperature 113 C 113 C
Svhc No SVHC (17-Dec-2015) No SVHC (17-Dec-2015)

We are delighted to provide the G4A01128C from our Thermodisc manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the G4A01128C and other electronic components in the Thermodisc manufacturer and beyond.

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Additional Infomation About Product

MICROTEMP Thermal Cutoffs: INTRODUCTION Upper Limit Temperature Protection MICROTEMP thermal cutoffs from Therm-O-Disc offer an accurate, reliable solution to the need for upper limit temperature protection. Known as a thermal fuse, thermal link, or TCO, the MICROTEMP thermal cutoff provides protection against overheating by interrupting an electrical circuit when operating temperatures exceed the rated temperature of the cutoff. MICROTEMP Features: One-shot operation cuts off electrical power Current interrupt capacity up to 25 amps 250VAC Low resistance Compact size Operating Principle of the MICROTEMP TCO The active trigger mechanism of the thermal cutoff is an exclusively formulated, electrically nonconductive pellet. Under normal operating temperatures, the solid pellet holds spring-loaded contacts closed. When a predetermined temperature is reached, the pellet melts, allowing the compression spring to relax. The trip spring then slides the contact away from the lead and the circuit is opened (see figures 1 and 2). After a MICROTEMP thermal cutoff opens a circuit, the TCO needs to be replaced. This replacement procedure must include correction of the fault condition before the product is operated again. 1 MICROTEMP G4, G6 & G7 Series TCO Before Operation After Operation CASE AND LEAD CASE AND LEAD ASSEMBLY ASSEMBLY THERMAL PELLET DISCS COMPRESSION SPRING DISCS COMPRESSION SPRING STAR CONTACT TRIP SPRING STAR CONTACT TRIP SPRING CERAMIC CERAMIC BUSHING BUSHING ISOLATED ISOLATED LEAD LEAD EPOXY EPOXY SEAL SEAL Grey area shows Grey area shows opened or current path broken current path Figure 1 MICROTEMP G5 & G8 Series TCO Before Operation After Operation CASE AND LEAD CASE AND LEAD ASSEMBLY THERMAL ASSEMBLY PELLET DISCS COMPRESSION SPRING COMPRESSION DISCS SPRING STAR CONTACT STAR CONTACT TRIP SPRING TRIP SPRING FLOATING CONTACT FLOATING CERAMIC CONTACT BUSHING CERAMIC ISOLATED LEAD BUSHING ISOLATED LEAD EPOXY EPOXY SEAL SEAL Grey area shows opened or Grey area shows broken current path current path Figure 2 2

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