SEMICONDUCTOR GENERAL CATALOG Microcomputers 8-Bit Microcontrollers 16-Bit Microcontrollers 32-Bit Microcontrollers 8-Bit Microcontrollers for Automotive 16-Bit Microcontrollers for Automotive 32-Bit Microcontrollers for Automotive 32-Bit Microprocessors 64-Bit Microprocessors Development System Tools 1 2011/9 SCE0004L Part Numbering Nomenclature Example 1 TMP 89 F S 60 x x UG Package QG: Plastic shrink quad outline non-leaded package (VQON) dry-packed XBG: Plastic ball grid array (BGA) dry-packed WBG: Wafer level chip size package (WCSP), dry-packed UG, DUG, FG, DFG: Plastic quad flat package (QFP) dry-packed MG, DMG: Plastic small-outline package (SOP) dry-packed NG: Plastic shrink dual in-line package (SDIP) PG: Plastic standard dual in-line package (DIP) Automotive quality grade R: Grade A, 40C to 85C T: Grade A, 40C to 125C I: Grade B, 40C to 85C S: Grade B, 40C to 125C Microcontroller revision Microcontroller subtype ROM size 1 23 468 C H KB 1 2 3 4 6 8 12 16 K M N P S U W F Y Z D KB 24 32 40 48 60/64 96 128 192 256 384 512 ROM type C: Mask E: EEPROM F: Flash P: OTP Microcontroller core 86: 870/C 88: 870/X 89: 870/C1 91: 900/L1 92, 94: 900/H1 93: 900/L 95: 900/H 96: 900 Toshiba microcontrollers Example 2 TMP 19A 23 F Y x x XBG Package XBG: Plastic ball grid array (BGA) dry-packed UG, FG, DFG: Plastic quad flat package (QFP) dry-packed Automotive quality grade R: Grade A, 40C to 85C T: Grade A, 40C to 125C I: Grade B, 40C to 85C S: Grade B, 40C to 125C Part designator / Microcontroller ROM size H M R S W Y Z D E 10 1D 20 KB 16 32 56 64 128 256 384 512 768 1024 15362048 ROM type C: Mask F: Flash Microcontroller subtype Microcontroller core M3: 03 A9: 09 19A: 19A, 19A/H1 Toshiba microcontrollers 2 2011/9 SCE0004L