TC35661SBG SINGle ChIp CoNTroller For BlueT oo Th ClaSSIC (3.0+eDr) aND BlueT oo Th le (4.0) usiness including full service supply chain managementFirmilne mendeessus faucerbi fue mo The TC35661SBG is a highly integrated RFCMOS Bluetooth device which supports Bluetooth Classic (3.0+EDR) and the new BT LE (low energy) 4.0 standard. This product supports the standard Bluetooth HCI interface and offers integration of stack and selected BT profiles on-chip. Through its WIFI coexistence interface it supports the BT3.0-HS function. The device realises an easy way to integrate Bluetooth for various industrial, medical and automotive applications. Toshiba has tested the Bluetooth interoperability extensively. All Toshiba Bluetooth devices and software are BQB qualified. Key BeNeFITS Dual Mode core for classic and new Bluetooth 4.0 standard Proven interoperability of Bluetooth hardware and software Flexible system architectures through HCI model Embedded Profile Model Stand Alone Model Optional embedded on-chip Bluetooth stack and profiles for easy made Bluetooth system design Stand Alone operation for small application feasible without Host MCU Two layer PCB design feasable ( 0.8mm ball pitch) for low cost design Ultra low BoM due to very few external components Multiple programmable IO options On-chip voltage controller and low power modes Consumer and Automotive Qualification (AEC-Q100) System System Configuration Product ID(*) HCI HCI TC35661-007 SPP TC35661-203 HID TC35661-100 BLE TC35661-300 Embedded Profile SPP+BLE TC35661-501 SPP+HID TC35661-600 Stand Alone With Profile SPP Stand Alone TC35661-700 BLE Stand Alone TC35661-5xx (*) SUBECTj TO FIRMWARE UPDATES. SUBECTj TO CHAnGE WITHOUT nOTICE.Fea TureS Bluetooth Core Spec 3.0 and 4.0, EDR and LE support TC356610xx : HCI type TC35661xxx : embedded profile type BT Class 2 support RF Sensitivity 91dBm typ. Baseband with ARM7TDMI - 13 to 52 MHz Onchip ROM, RAM, incl. PatchRAM ROMless version available usiness including full service supply chain managementFirmilne mendeessus faucerbi Onchip Balun, Antenna SW, Ln A, LDO fue mo Interfaces: UART, SPI, USB2.0(FS), I2C, I2S/PCM, GPIO IEEE802.15.2. 2/3/4 coexistence interface Block Diagram Data Transfer up to 2 Mbps (DH5 packets) net Package: 64ball BGA (ROM version) - 0.5/0.8 mm pitch Package 121ball BGA (ROMless version) - 0.65mm pitch Operational Voltage: 1.8V or 3.3V (typ.) Low power sleep mode 30uA (max) Operation Mode <30mA (depends on packet-type and selected operational mode) AEC-Q100 automotive qualificaton (under development) hCI Sy STem CoNCepT The Bluetooth HCI (host controller interface) model: the low layer stack (RF, LC, LM) runs on the TC35661SBG device (ROM or external flash memory). Through a UART or USB it is connected to an external host processor, which executes the upper Blueooth stack (L2CAP, RFCOMM) and profiles. Beyond the upper stack the host processor runs the application software. This application processor may also run additional tasks such as middleware and multimedia functions. This concept is suitable for voice and data.