X-On Electronics has gained recognition as a prominent supplier of TC3567DFSG-002(ELG RF Transceiver across the USA, India, Europe, Australia, and various other global locations. TC3567DFSG-002(ELG RF Transceiver are a product manufactured by Toshiba. We provide cost-effective solutions for RF Transceiver, ensuring timely deliveries around the world.

TC3567DFSG-002(ELG Toshiba

TC3567DFSG-002(ELG electronic component of Toshiba
TC3567DFSG-002(ELG Toshiba
TC3567DFSG-002(ELG RF Transceiver
TC3567DFSG-002(ELG  Semiconductors

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Part No. TC3567DFSG-002(ELG
Manufacturer: Toshiba
Category: RF Transceiver
Description: RF Transceiver Bluetooth 4.2 IC 0dBm 3.6V 3.3mA
Datasheet: TC3567DFSG-002(ELG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 3.5743
10 : USD 3.2514
100 : USD 2.7392
250 : USD 2.5945
500 : USD 2.3717
1000 : USD 2.1713
2000 : USD 1.9709
10000 : USD 1.9486
N/A

Obsolete
   
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We are delighted to provide the TC3567DFSG-002(ELG from our RF Transceiver category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TC3567DFSG-002(ELG and other electronic components in the RF Transceiver category and beyond.

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TC3567DFSG-002 TC3567DFSG-002 Bluetooth low energy IC Rev 1.2 The Bluetooth word mark and logos are registered trademarks owned by the BluetSootIGh, Inc. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. 2017-2018 1 2018-04-26 Toshiba Electronic Devices & Storage Corporation TC3567DFSG-002 Contents 1. General Description ...............................................................................................................................................................................4 1.1. Product Concept ...............................................................................................................................................................................4 1.2. Features .............................................................................................................................................................................................4 2. Pin Function ...........................................................................................................................................................................................6 2.1. TC3567DFSG Pin Assignment (Top View)......................................................................................................................................6 2.2. Pin Function Descriptions .................................................................................................................................................................7 2.3. GPIO function list ............................................................................................................................................................................ 10 2.4. Power Supply Pins ......................................................................................................................................................................... 12 3. System Configuration ......................................................................................................................................................................... 13 3.1. Block Diagram ................................................................................................................................................................................ 13 3.2. Boot Sequence ............................................................................................................................................................................... 14 4. Functional Specifications .................................................................................................................................................................... 15 4.1. Bluetooth Function ....................................................................................................................................................................... 15 4.1.1. Supported Function ........................................................................................................................................................... 15 4.1.2. Support Protocol Layer ...................................................................................................................................................... 16 4.1.3. RF ....................................................................................................................................................................................... 17 4.1.4. Auto Advertise Function ..................................................................................................................................................... 17 4.2. Reset Interface (Power up sequence) .......................................................................................................................................... 18 4.2.1. Features ............................................................................................................................................................................. 18 4.2.2. Connection Example ......................................................................................................................................................... 18 4.3. UART Interface ............................................................................................................................................................................... 19 4.3.1. Features ............................................................................................................................................................................. 19 4.3.2. Connection Example ......................................................................................................................................................... 19 4.3.3. Frame Format .................................................................................................................................................................... 20 4.3.4. Flow Control Function ........................................................................................................................................................ 20 4.3.5. Baud rate ........................................................................................................................................................................... 21 4.3.6. TX message spacing function ........................................................................................................................................... 21 4.3.7. Error Detecting Functions .................................................................................................................................................. 22 4.3.8. Host Wake up Function ..................................................................................................................................................... 23 4.3.9. HCI mode ........................................................................................................................................................................... 23 4.3.9.1. HCI Reset ...................................................................................................................................................................... 23 4.4. SPI Interface ................................................................................................................................................................................... 24 4.4.1. Features ............................................................................................................................................................................. 24 4.4.2. Connection Example ......................................................................................................................................................... 24 4.4.3. Frame Format .................................................................................................................................................................... 25 2 4.5. I C Interface .................................................................................................................................................................................... 26 4.5.1. Features ............................................................................................................................................................................. 26 4.5.2. Connection Example ......................................................................................................................................................... 26 4.5.3. Selection of External Pull-up Resistor Value .................................................................................................................... 27 4.5.4. Frame Format .................................................................................................................................................................... 28 4.6. PWM Interface ................................................................................................................................................................................ 29 4.6.1. Pulse Generation Function.............................................................................................................................................. 29 4.6.2. Rhythm Function (Output Masking) .................................................................................................................................. 30 4.7. ADC ................................................................................................................................................................................................ 31 4.7.1. Features ............................................................................................................................................................................. 31 4.7.2. Descriptions ....................................................................................................................................................................... 31 2 2018-04-26

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
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