X-On Electronics has gained recognition as a prominent supplier of TC3567DFSG-002(ELG RF Transceiver across the USA, India, Europe, Australia, and various other global locations. TC3567DFSG-002(ELG RF Transceiver are a product manufactured by Toshiba. We provide cost-effective solutions for RF Transceiver, ensuring timely deliveries around the world.

TC3567DFSG-002(ELG Toshiba

Name: TC3567DFSG-002(ELG
Brand: Toshiba
SKU: TC3567DFSG002ELG_Toshiba
Availability: OutOfStock
Rating: 5 (11 reviews)

TC3567DFSG-002(ELG electronic component of Toshiba

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See Product Specifications

Part No.	TC3567DFSG-002(ELG
Manufacturer:	Toshiba
Category:	RF Transceiver
Description:	RF Transceiver Bluetooth 4.2 IC 0dBm 3.6V 3.3mA
Datasheet:	TC3567DFSG-002(ELG Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

TC3567DFSG-002(ELG More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 3.5743 10 : USD 3.2514 100 : USD 2.7392 250 : USD 2.5945 500 : USD 2.3717 1000 : USD 2.1713 2000 : USD 1.9709 10000 : USD 1.9486		N/A Obsolete

We are delighted to provide the TC3567DFSG-002(ELG from our RF Transceiver category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TC3567DFSG-002(ELG and other electronic components in the RF Transceiver category and beyond.

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Additional Infomation About Product

TC3567DFSG-002 TC3567DFSG-002 Bluetooth low energy IC Rev 1.2 The Bluetooth word mark and logos are registered trademarks owned by the BluetSootIGh, Inc. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. 2017-2018 1 2018-04-26 Toshiba Electronic Devices & Storage Corporation TC3567DFSG-002 Contents 1. General Description ...............................................................................................................................................................................4 1.1. Product Concept ...............................................................................................................................................................................4 1.2. Features .............................................................................................................................................................................................4 2. Pin Function ...........................................................................................................................................................................................6 2.1. TC3567DFSG Pin Assignment (Top View)......................................................................................................................................6 2.2. Pin Function Descriptions .................................................................................................................................................................7 2.3. GPIO function list ............................................................................................................................................................................ 10 2.4. Power Supply Pins ......................................................................................................................................................................... 12 3. System Configuration ......................................................................................................................................................................... 13 3.1. Block Diagram ................................................................................................................................................................................ 13 3.2. Boot Sequence ............................................................................................................................................................................... 14 4. Functional Specifications .................................................................................................................................................................... 15 4.1. Bluetooth Function ....................................................................................................................................................................... 15 4.1.1. Supported Function ........................................................................................................................................................... 15 4.1.2. Support Protocol Layer ...................................................................................................................................................... 16 4.1.3. RF ....................................................................................................................................................................................... 17 4.1.4. Auto Advertise Function ..................................................................................................................................................... 17 4.2. Reset Interface (Power up sequence) .......................................................................................................................................... 18 4.2.1. Features ............................................................................................................................................................................. 18 4.2.2. Connection Example ......................................................................................................................................................... 18 4.3. UART Interface ............................................................................................................................................................................... 19 4.3.1. Features ............................................................................................................................................................................. 19 4.3.2. Connection Example ......................................................................................................................................................... 19 4.3.3. Frame Format .................................................................................................................................................................... 20 4.3.4. Flow Control Function ........................................................................................................................................................ 20 4.3.5. Baud rate ........................................................................................................................................................................... 21 4.3.6. TX message spacing function ........................................................................................................................................... 21 4.3.7. Error Detecting Functions .................................................................................................................................................. 22 4.3.8. Host Wake up Function ..................................................................................................................................................... 23 4.3.9. HCI mode ........................................................................................................................................................................... 23 4.3.9.1. HCI Reset ...................................................................................................................................................................... 23 4.4. SPI Interface ................................................................................................................................................................................... 24 4.4.1. Features ............................................................................................................................................................................. 24 4.4.2. Connection Example ......................................................................................................................................................... 24 4.4.3. Frame Format .................................................................................................................................................................... 25 2 4.5. I C Interface .................................................................................................................................................................................... 26 4.5.1. Features ............................................................................................................................................................................. 26 4.5.2. Connection Example ......................................................................................................................................................... 26 4.5.3. Selection of External Pull-up Resistor Value .................................................................................................................... 27 4.5.4. Frame Format .................................................................................................................................................................... 28 4.6. PWM Interface ................................................................................................................................................................................ 29 4.6.1. Pulse Generation Function.............................................................................................................................................. 29 4.6.2. Rhythm Function (Output Masking) .................................................................................................................................. 30 4.7. ADC ................................................................................................................................................................................................ 31 4.7.1. Features ............................................................................................................................................................................. 31 4.7.2. Descriptions ....................................................................................................................................................................... 31 2 2018-04-26

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

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Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
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Manufacturer Toshiba Toshiba
Product Category RF Transceiver RF Transceiver
RoHS - XON Y Y
Frequency Range 2400 MHz to 2483.5 MHz 2400 MHz to 2483.5 MHz
Maximum Data Rate 921.6 Kb/S 921.6 Kb/S
Modulation Format Gfsk Gfsk
Output Power 0 dBm 0 dBm
Type Bluetooth Bluetooth
Maximum Operating Temperature + 85 C + 85 C
Interface Type I2c, Spi, Uart I2c, Spi, Uart
Package / Case QFN - 40 QFN - 40
Packaging Cut Tape Cut Tape
Minimum Operating Temperature - 40 C - 40 C
Supply Voltage - Min 1.8 V 1.8 V
Supply Voltage - Max 3.6 V 3.6 V
Supply Current Receiving 3.3 mA 3.3 mA
Supply Current Transmitting 3.3 mA 3.3 mA
Sensitivity - 93.5 Dbm - 93.5 Dbm
Brand Toshiba Toshiba
Mounting Style Smd/Smt Smd/Smt
Number Of Receivers 1 Receiver 1 Receiver
Number Of Transmitters 1 Transmitter 1 Transmitter
Product Type Rf Transceiver Rf Transceiver
Factory Pack Quantity : 2000 2000
Subcategory Wireless & Rf Integrated Circuits Wireless & Rf Integrated Circuits
Hts Code 8542390001 8542390001