X-On Electronics has gained recognition as a prominent supplier of TE0712-02-200-2C System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0712-02-200-2C System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0712-02-200-2C Trenz Electronic

TE0712-02-200-2C electronic component of Trenz Electronic
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Part No.TE0712-02-200-2C
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM FPGA Module with Xilinx Artix-7 XC7A200T-2FBG484C 1 GByte DDR3 4 x 5 cm
Datasheet: TE0712-02-200-2C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 305.3842
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We are delighted to provide the TE0712-02-200-2C from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0712-02-200-2C and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0712 TRM Revision v.26 Exported on 2021-03-23 Online version of this document: TE0712 TRM Revision: v.26 1 Table of Contents 1 Table of Contents..................................................................................................................................................... 2 2 Table of Figures........................................................................................................................................................ 4 3 Table of Tables ......................................................................................................................................................... 5 4 Overview................................................................................................................................................................... 6 4.1 Key Features............................................................................................................................................................. 6 4.2 Block Diagram .......................................................................................................................................................... 7 4.3 Main Components .................................................................................................................................................... 8 4.4 Initial Delivery State................................................................................................................................................. 8 5 Signals, Interfaces and Pins................................................................................................................................... 10 5.1 Board to Board (B2B) I/Os ..................................................................................................................................... 10 5.2 JTAG Interface ........................................................................................................................................................ 10 5.3 System Controller I/O Pins .................................................................................................................................... 11 5.4 On-board LEDs ....................................................................................................................................................... 11 5.5 Clocking .................................................................................................................................................................. 12 6 On-board Peripherals ............................................................................................................................................ 13 6.1 32 MByte Quad SPI Flash Memory......................................................................................................................... 13 6.2 System Controller CPLD ........................................................................................................................................ 13 6.3 DDR3 SDRAM .......................................................................................................................................................... 13 6.4 Ethernet PHY .......................................................................................................................................................... 13 6.5 MAC Address EEPROM............................................................................................................................................ 14 7 Power and Power-On Sequence............................................................................................................................ 15 7.1 Power Supply ......................................................................................................................................................... 15 7.2 Power-On Sequence .............................................................................................................................................. 15 7.3 Power Rails ............................................................................................................................................................. 16 8 Board to Board Connectors................................................................................................................................... 17 8.1 Connector Mating height ....................................................................................................................................... 17 8.2 Connector Speed Ratings ...................................................................................................................................... 18 8.3 Current Rating ........................................................................................................................................................ 18 8.4 Connector Mechanical Ratings.............................................................................................................................. 18 9 Technical Specifications........................................................................................................................................ 19 9.1 Absolute Maximum Ratings ................................................................................................................................... 19 9.2 Recommended Operating Conditions .................................................................................................................. 19 9.3 Physical Dimensions .............................................................................................................................................. 20 9.4 Weight..................................................................................................................................................................... 20 10 Currently Offered Variants..................................................................................................................................... 21 Copyright 2021Trenz Electronic GmbH 2 of 25

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