X-On Electronics has gained recognition as a prominent supplier of TE0713-02-200-2C System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0713-02-200-2C System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0713-02-200-2C Trenz Electronic

Name: TE0713-02-200-2C
Brand: Trenz Electronic
SKU: TE0713022002C_Trenz_Electronic
Availability: OutOfStock
Rating: 5 (11 reviews)

TE0713-02-200-2C electronic component of Trenz Electronic

TE0713-02-200-2C System-On-Modules - SOM

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Part No.	TE0713-02-200-2C
Manufacturer:	Trenz Electronic
Category:	System-On-Modules - SOM
Description:	System-On-Modules - SOM FPGA Module with Xilinx Artix-7 XC7A200T-2FBG484C 4 x 5 cm 1 GByte DDR3L
Datasheet:	TE0713-02-200-2C Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

TE0713-02-200-2C More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 337.3016		N/A Obsolete

Specifications

Manufacturer Trenz Electronic Trenz Electronic
Product Category System-On-Modules - SOM System-On-Modules - SOM
Category System-On-Modules - SOM System-On-Modules - SOM
Factory Pack Quantity : 1 1

We are delighted to provide the TE0713-02-200-2C from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0713-02-200-2C and other electronic components in the System-On-Modules - SOM category and beyond.

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Additional Infomation About Product

TE0713 TRM Revision v.13 Exported on 2019-03-07 Online version of this document: TE0713 TRM Revision: v.13 1 Table of Contents 1 Table of Contents................................................................................................................................................... 2 2 Table of Figures...................................................................................................................................................... 4 3 Table of Tables ....................................................................................................................................................... 5 4 Overview................................................................................................................................................................. 6 4.1 Key Features........................................................................................................................................................... 6 4.2 Block Diagram ........................................................................................................................................................ 7 4.3 Main Components.................................................................................................................................................. 7 4.4 Initial Delivery State............................................................................................................................................... 8 5 Signals, Interfaces and Pins................................................................................................................................... 9 5.1 Board to Board (B2B) I/Os ..................................................................................................................................... 9 5.2 JTAG Interface........................................................................................................................................................ 9 5.3 System Controller I/O Pins .................................................................................................................................. 10 5.4 On-board LEDs ..................................................................................................................................................... 10 5.5 Clocking ................................................................................................................................................................ 11 6 On-board Peripherals .......................................................................................................................................... 12 6.1 32 MByte Quad SPI Flash Memory....................................................................................................................... 12 6.2 System Controller CPLD ...................................................................................................................................... 12 6.3 DDR3L SDRAM ...................................................................................................................................................... 12 6.4 USB 3.0 to FIFO Bridge ......................................................................................................................................... 12 7 Power and Power-On Sequence ......................................................................................................................... 13 7.1 Power Supply ....................................................................................................................................................... 13 7.2 Power-On Sequence ............................................................................................................................................ 13 7.3 Power Rails........................................................................................................................................................... 13 8 Board to Board Connectors................................................................................................................................. 15 8.1 Connector Mating height ..................................................................................................................................... 15 8.2 Connector Speed Ratings .................................................................................................................................... 16 8.3 Current Rating ...................................................................................................................................................... 16 8.4 Connector Mechanical Ratings............................................................................................................................ 16 9 Variants Currently In Production ........................................................................................................................ 17 10 Technical Specifications...................................................................................................................................... 18 10.1 Absolute Maximum Ratings................................................................................................................................. 18 10.2 Recommended Operating Conditions ................................................................................................................ 18 10.3 Operating Temperature Ranges.......................................................................................................................... 19 10.4 Physical Dimensions ............................................................................................................................................ 19 10.5 Weight................................................................................................................................................................... 20 Copyright 2019Trenz Electronic GmbH 2 of 24

HS Compliance

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

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