X-On Electronics has gained recognition as a prominent supplier of TE0714-03-35-2I System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0714-03-35-2I System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0714-03-35-2I Trenz Electronic

TE0714-03-35-2I electronic component of Trenz Electronic
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Part No.TE0714-03-35-2I
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM FPGA Module with Xilinx Artix-7 XC7A35T-2CSG325I 33 V Configuration 4 x 3 cm
Datasheet: TE0714-03-35-2I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 140.1963
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We are delighted to provide the TE0714-03-35-2I from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0714-03-35-2I and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0714 TRM Revision v.55 Exported on 2019-03-04 Online version of this document: TE0714 TRM Revision: v.55 1 Table of Contents 1 Table of Contents................................................................................................................................................... 2 2 Table of Figures...................................................................................................................................................... 4 3 Table of Tables ....................................................................................................................................................... 5 4 Overview................................................................................................................................................................. 6 4.1 Key Features........................................................................................................................................................... 6 4.2 Block Diagram ........................................................................................................................................................ 6 4.3 Main Components.................................................................................................................................................. 7 4.4 Initial Delivery State............................................................................................................................................... 8 4.5 Control Signals ....................................................................................................................................................... 8 5 Signals, Interfaces and Pins................................................................................................................................... 9 5.1 JTAG Interface........................................................................................................................................................ 9 5.2 Board to Board (B2B) I/Os ..................................................................................................................................... 9 6 On-board Peripherals .......................................................................................................................................... 10 6.1 Quad SPI Flash ..................................................................................................................................................... 10 6.2 On-board LED ....................................................................................................................................................... 10 6.3 Clock ..................................................................................................................................................................... 10 7 Power and Power-On Sequence ......................................................................................................................... 11 7.1 Power Consumption ............................................................................................................................................ 11 7.2 Power Distribution Dependencies ...................................................................................................................... 11 7.3 Power-On Sequence ............................................................................................................................................ 11 7.4 Power Rails........................................................................................................................................................... 12 7.5 Bank Voltages....................................................................................................................................................... 12 8 Board to Board Connectors................................................................................................................................. 13 8.1 Connector Speed Ratings .................................................................................................................................... 13 8.2 Current Rating ...................................................................................................................................................... 14 8.3 Connector Mechanical Ratings............................................................................................................................ 14 9 Technical Specifications...................................................................................................................................... 15 9.1 Absolute Maximum Ratings................................................................................................................................. 15 9.2 Recommended Operating Conditions ................................................................................................................ 15 9.3 Physical Dimensions ............................................................................................................................................ 15 10 Variants Currently In Production ........................................................................................................................ 17 11 Revision History ................................................................................................................................................... 18 11.1 Hardware Revision History .................................................................................................................................. 18 11.2 Document Change History .................................................................................................................................. 18 12 Disclaimer............................................................................................................................................................. 21 Copyright 2019Trenz Electronic GmbH 2 of 22

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:
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