X-On Electronics has gained recognition as a prominent supplier of TE0720-03-2IFC3 System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0720-03-2IFC3 System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0720-03-2IFC3 Trenz Electronic

Name: TE0720-03-2IFC3
Brand: Trenz Electronic
SKU: TE0720032IFC3_Trenz Electronic
Availability: OutOfStock
Rating: 5 (11 reviews)

TE0720-03-2IFC3 electronic component of Trenz Electronic

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Part No.	TE0720-03-2IFC3
Manufacturer:	Trenz Electronic
Category:	System-On-Modules - SOM
Description:	System-On-Modules - SOM SoC Module mit Xilinx Zynq XC7Z020-2CLG484I 1 GByte DDR3 4 x 5 cm low profile
Datasheet:	TE0720-03-2IFC3 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

TE0720-03-2IFC3 More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 292.8205		N/A Obsolete

Specifications

Manufacturer Trenz Electronic Trenz Electronic
Product Category System-On-Modules - SOM System-On-Modules - SOM
Category System-On-Modules - SOM System-On-Modules - SOM
Factory Pack Quantity : 1 1

We are delighted to provide the TE0720-03-2IFC3 from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0720-03-2IFC3 and other electronic components in the System-On-Modules - SOM category and beyond.

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Additional Infomation About Product

TE0720 TRM Revision v.93 Exported on 2021-03-04 Online version of this document: TE0720 TRM Revision: v.93 1 Table of Contents 1 Table of Contents..................................................................................................................................................... 2 2 Table of Figures........................................................................................................................................................ 4 3 Table of Tables ......................................................................................................................................................... 5 4 Overview................................................................................................................................................................... 6 4.1 Key Features............................................................................................................................................................. 6 4.2 Block Diagram .......................................................................................................................................................... 7 4.3 Main Components .................................................................................................................................................... 8 4.4 Initial Delivery State................................................................................................................................................. 9 5 Boot Process........................................................................................................................................................... 10 6 Signals, Interfaces and Pins................................................................................................................................... 11 6.1 Board to Board (B2B) I/Os ..................................................................................................................................... 11 6.2 JTAG Interface ........................................................................................................................................................ 12 6.3 System Controller CPLD I/O Pins........................................................................................................................... 12 6.4 Quad SPI Interface ................................................................................................................................................. 13 6.5 eMMC Interface....................................................................................................................................................... 13 6.6 Ethernet Interface .................................................................................................................................................. 14 6.7 USB Interface.......................................................................................................................................................... 15 6.8 I2C Interface ........................................................................................................................................................... 16 7 On-board Peripherals ............................................................................................................................................ 18 7.1 System Controller CPLD ........................................................................................................................................ 18 7.2 DDR Memory........................................................................................................................................................... 18 7.3 Quad SPI Flash Memory ......................................................................................................................................... 18 7.4 eMMC Flash Memory .............................................................................................................................................. 18 7.5 Gigabit Ethernet PHY ............................................................................................................................................. 18 7.6 High-speed USB ULPI PHY ..................................................................................................................................... 19 7.7 RTC - Real Time Clock ............................................................................................................................................ 19 7.8 MAC-Address EEPROM ........................................................................................................................................... 19 7.9 Atmel CryptoAuthentication Chip ......................................................................................................................... 19 7.10 eCompass module ................................................................................................................................................. 20 7.11 Oscillators............................................................................................................................................................... 20 7.12 On-board LEDs ....................................................................................................................................................... 20 8 Power and Power-On Sequence............................................................................................................................ 21 8.1 Power Supply ......................................................................................................................................................... 21 8.2 Power-On Sequence .............................................................................................................................................. 21 8.3 Power Rails ............................................................................................................................................................. 22 Copyright 2021Trenz Electronic GmbH 2 of 34

HS Compliance

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

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