X-On Electronics has gained recognition as a prominent supplier of TE0725LP-01-72C-1 System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0725LP-01-72C-1 System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0725LP-01-72C-1 Trenz Electronic

TE0725LP-01-72C-1 electronic component of Trenz Electronic
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Part No.TE0725LP-01-72C-1
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM FPGA Module with Xilinx Artix-7 100T Variant 2C 2 x 50 Pin 3.3V supply
Datasheet: TE0725LP-01-72C-1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 185.438 ea
Line Total: USD 185.44 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 185.438

   
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We are delighted to provide the TE0725LP-01-72C-1 from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0725LP-01-72C-1 and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0725LP TRM Revision: v.45 Exported on: 06/29/2018TE0725LP TRM v.45 1 Table of Contents 1 Table of Contents...................................................................................................................................... 2 2 Overview.................................................................................................................................................... 4 2.1 Key Features.............................................................................................................................................. 4 2.2 Block Diagram ........................................................................................................................................... 4 2.3 Main Components..................................................................................................................................... 5 2.4 Initial Delivery State.................................................................................................................................. 6 3 Boot Process.............................................................................................................................................. 7 4 Signals, Interfaces and Pins...................................................................................................................... 8 4.1 I/Os on Pin Headers .................................................................................................................................. 8 4.2 PL I/O-Banks.............................................................................................................................................. 8 4.3 JTAG Interface........................................................................................................................................... 8 4.3.1 XMOD FTDI JTAG-Adapter Header JB1 .................................................................................................... 8 4.4 UART Interface .......................................................................................................................................... 9 4.5 QSPI Interface ........................................................................................................................................... 9 4.6 I2C Interface ............................................................................................................................................ 10 4.7 Differential Analog Input ........................................................................................................................ 10 5 On-board Peripherals ............................................................................................................................. 11 5.1 Quad SPI Flash Memory.......................................................................................................................... 11 5.2 HyperFlash Memory............................................................................................................................. 11 5.3 EEPROM ................................................................................................................................................... 11 5.4 System Clock Oscillator .......................................................................................................................... 11 5.5 On-board LEDs ........................................................................................................................................ 11 5.6 Connectors .............................................................................................................................................. 11 6 Power and Power-On Sequence ............................................................................................................ 12 6.1 Power Supply .......................................................................................................................................... 12 6.2 Power Consumption ............................................................................................................................... 12 6.3 Power-On Sequence ............................................................................................................................... 12 6.4 Voltage Monitor Circuit ........................................................................................................................... 12 6.5 Power Rails.............................................................................................................................................. 13 6.6 Bank Voltages.......................................................................................................................................... 13 7 Variants Currently In Production ........................................................................................................... 14 8 Technical Specifications......................................................................................................................... 15 8.1 Absolute Maximum Ratings.................................................................................................................... 15 8.2 Recommended Operating Conditions ................................................................................................... 15 8.3 Physical Dimensions ............................................................................................................................... 15 Copyright 2018Trenz Electronic GmbH 2 of 19

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