X-On Electronics has gained recognition as a prominent supplier of TE0728-04-1Q System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0728-04-1Q System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0728-04-1Q Trenz Electronic

TE0728-04-1Q electronic component of Trenz Electronic
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Part No.TE0728-04-1Q
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM SoC Module with Xilinx Automotive Zynq-7020 512 MByte DDR3L 6 x 6 cm
Datasheet: TE0728-04-1Q Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 540.65 ea
Line Total: USD 540.65 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 540.65

   
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We are delighted to provide the TE0728-04-1Q from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0728-04-1Q and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0728 TRM Revision v.366 Exported on 2019-04-30 Online version of this document: TE0728 TRM Revision: v.366 1 Table of Contents 1 Table of Contents................................................................................................................................................... 2 2 Table of Figures...................................................................................................................................................... 4 3 Table of Tables ....................................................................................................................................................... 5 4 Overview................................................................................................................................................................. 7 4.1 Key Features........................................................................................................................................................... 7 4.2 Block Diagram ........................................................................................................................................................ 7 4.3 Main Components.................................................................................................................................................. 8 4.4 Initial Delivery State............................................................................................................................................... 9 4.5 Configuration Signals ............................................................................................................................................ 9 5 Signals, Interfaces and Pins................................................................................................................................. 11 5.1 Board to Board (B2B) I/Os ................................................................................................................................... 11 5.2 Ethernet PHY ........................................................................................................................................................ 11 5.3 CAN PHY................................................................................................................................................................ 12 5.4 JTAG Interface...................................................................................................................................................... 12 5.5 MIO Pins................................................................................................................................................................ 12 6 On-board Peripherals .......................................................................................................................................... 14 6.1 Quad SPI Flash Memory....................................................................................................................................... 14 6.2 RTC ....................................................................................................................................................................... 15 6.3 EEPROM ................................................................................................................................................................ 15 6.4 LEDs ...................................................................................................................................................................... 15 6.5 DDR3 SDRAM ........................................................................................................................................................ 15 6.6 Ethernet ................................................................................................................................................................ 16 6.7 CAN Transceiver ................................................................................................................................................... 16 6.8 Oscillators............................................................................................................................................................. 17 7 Power and Power-On Sequence ......................................................................................................................... 18 7.1 Power Supply ....................................................................................................................................................... 18 7.2 Power Consumption ............................................................................................................................................ 18 7.3 Power DistributionDependencies ...................................................................................................................... 18 7.4 Power on Sequence ............................................................................................................................................. 18 7.5 Voltage Monitor Circuit ........................................................................................................................................ 19 7.6 Power Rails........................................................................................................................................................... 20 7.7 Bank Voltages....................................................................................................................................................... 20 8 Board to Board Connectors................................................................................................................................. 21 8.1 Connector Mating height ..................................................................................................................................... 21 8.2 Connector Speed Ratings .................................................................................................................................... 21 Copyright 2019Trenz Electronic GmbH 2 of 28

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

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