X-On Electronics has gained recognition as a prominent supplier of TE0729-02-2IF System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0729-02-2IF System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

TE0729-02-2IF Trenz Electronic

Name: TE0729-02-2IF
Brand: Trenz Electronic
SKU: TE0729022IF_Trenz Electronic
Availability: OutOfStock
Rating: 5 (11 reviews)

TE0729-02-2IF electronic component of Trenz Electronic

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Part No.	TE0729-02-2IF
Manufacturer:	Trenz Electronic
Category:	System-On-Modules - SOM
Description:	System-On-Modules - SOM SoC Module with Xilinx Zynq-7020 512 MByte DDR3 SDRAM 3 x Ethernet
Datasheet:	TE0729-02-2IF Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

TE0729-02-2IF More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 261.5242		N/A Obsolete

Specifications

Manufacturer Trenz Electronic Trenz Electronic
Product Category System-On-Modules - SOM System-On-Modules - SOM
Category System-On-Modules - SOM System-On-Modules - SOM
Factory Pack Quantity : 1 1

We are delighted to provide the TE0729-02-2IF from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0729-02-2IF and other electronic components in the System-On-Modules - SOM category and beyond.

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Additional Infomation About Product

TE0729 TRM Revision: V.29 Exported on: 08/29/2018TE0729 TRM V.29 1 Table of Contents 1 Table of Contents......................................................................................................................................... 2 2 Overview....................................................................................................................................................... 4 2.1 Key Features................................................................................................................................................. 4 2.2 Block Diagram .............................................................................................................................................. 5 2.3 Main Components........................................................................................................................................ 5 2.4 Initial Delivery State..................................................................................................................................... 6 3 Signals, Interfaces and Pins......................................................................................................................... 7 3.1 Board to Board (B2B) I/Os ........................................................................................................................... 7 3.2 JTAG Interface.............................................................................................................................................. 7 3.3 System Controller I/O Pins .......................................................................................................................... 7 3.4 On-board LEDs ............................................................................................................................................. 8 3.5 Clocking ........................................................................................................................................................ 8 3.6 Default MIO mapping ................................................................................................................................... 8 3.7 Boot Modes................................................................................................................................................... 9 4 Processing System (PS) Peripherals ......................................................................................................... 10 5 I2C Interface ............................................................................................................................................... 11 5.1 I2C addresses for on-board components ................................................................................................. 11 6 On-board Peripherals ................................................................................................................................ 12 6.1 Gigabit Ethernet ......................................................................................................................................... 12 6.2 USB Interface.............................................................................................................................................. 13 6.3 RTC - Real Time Clock ................................................................................................................................ 13 6.4 MAC-Address EEPROMs ............................................................................................................................. 13 6.5 Watchdog ................................................................................................................................................... 13 7 Power and Power-On Sequence ............................................................................................................... 14 7.1 Power Supplies .......................................................................................................................................... 14 7.2 Bank Voltages............................................................................................................................................. 14 7.3 Power-up sequence at start-up................................................................................................................. 14 8 Board to Board Connectors....................................................................................................................... 16 9 Technical Specification ............................................................................................................................. 17 9.1 Absolute Maximum Ratings....................................................................................................................... 17 9.2 Recommended Operating Conditions ...................................................................................................... 17 9.3 Physical Dimensions .................................................................................................................................. 17 9.4 Operating Temperature Ranges................................................................................................................ 18 9.5 Weight......................................................................................................................................................... 18 Copyright 2018Trenz Electronic GmbH 2 of 21

HS Compliance

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

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